Continuous growing multilayer cube-texture insulating layer on metallic substrate and preparation method thereof

A technology of metal baseband and cubic texture, which is applied in metal material coating process, coating, ion implantation plating, etc., can solve the problems of low sputtering yield and slow film growth rate, and achieve sputtering yield High, slow film growth rate, fast growth rate

Active Publication Date: 2009-09-09
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sputtering yield of the ceramic oxide target is lower than that of the corresponding metal target, so the film growth rate is slow, and the sputtering power supply of radio frequency must be used

Method used

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  • Continuous growing multilayer cube-texture insulating layer on metallic substrate and preparation method thereof
  • Continuous growing multilayer cube-texture insulating layer on metallic substrate and preparation method thereof
  • Continuous growing multilayer cube-texture insulating layer on metallic substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Connect the front and rear ends of the metal base tape with cubic texture to the leader tape and clean it. Wrap the cleaned metal base tape and leader tape on the unwinding and take-up reels, place them in a vacuum chamber, and place the leader part in the deposition area. Vacuum until the back vacuum of the cavity is less than or equal to 5×10 -4 Pa; heat the metal substrate to 500°C, and after reaching the required temperature for 30 minutes, fill the chamber with argon to a pressure of 1×10 -1 Pa.

[0059] Taking Y metal as the sputtering target, adopting the DC magnetron sputtering deposition method, the injection power is 320W, and the target base distance is 120mm, and the pre-sputtering is started. After 20 minutes of pre-sputtering, water vapor was introduced to control the water content in the deposition chamber at 1×10 -3 Pa, and adjust the pressure in the deposition chamber to 1Pa, and start the formal sputtering deposition. After the official sputtering ...

Embodiment 2

[0075] Connect the front and rear ends of the metal base tape with cubic texture to the leader tape and clean it. Wrap the cleaned metal base tape and leader tape on the unwinding and take-up reels, place them in a vacuum chamber, and place the leader part in the deposition area. Vacuum until the back vacuum of the cavity is less than or equal to 5×10 -4 Pa; heat the metal substrate to 700°C, and after reaching the required temperature for 30 minutes, fill the chamber with argon to a pressure of 5×10 -1 Pa.

[0076] Taking Y metal as the sputtering target material, using the DC magnetron sputtering deposition method, the injection power is 350W, and the target base distance is 60mm, and the pre-sputtering is started. After 20 minutes of pre-sputtering, water vapor was introduced to control the water content in the deposition chamber at 8×10 -3 Pa, and adjust the pressure in the deposition chamber to 2Pa, and start the formal sputtering deposition. After the official sputte...

Embodiment 3

[0083] Connect the front and rear ends of the metal base tape with cubic texture to the leader tape and clean it. Wrap the cleaned metal base tape and leader tape on the unwinding and take-up reels, place them in a vacuum chamber, and place the leader part in the deposition area. Vacuum until the back vacuum of the cavity is less than or equal to 5×10 -4 Pa; heat the metal substrate to 800°C, and after reaching the required temperature for 30 minutes, fill the chamber with argon to a pressure of 8×10 -1 Pa.

[0084] Taking Y metal as the sputtering target material, using the DC magnetron sputtering deposition method, the injection power is 350W, and the target base distance is 80mm, and the pre-sputtering is started. After 20 minutes of pre-sputtering, water vapor was introduced to control the water content in the deposition chamber at 7×10 -3 Pa, and adjust the pressure in the deposition chamber to 5Pa, and start the formal sputtering deposition. After the official sputte...

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Abstract

The invention relates to a multi-layer cubic texture oxide isolation layer continuously grown on a metal base belt, which has three layers of yttrium oxide film, yttrium stabilized zirconia film and cerium oxide film successively on the metal base belt with cubic texture. A method for preparing a continuous growth multilayer cubic texture oxide isolation layer, comprising: (1) cleaning a metal base tape; (2) winding the metal base tape on a take-up pulley and a take-up pulley; (3) using Y metal as the sputtering target, pre-sputtering; (4) making the metal baseband pass through the deposition area, and sputtering deposits yttrium oxide; (5) using Zr-Y metal as the sputtering target, pre-sputtering; (6) making the metal baseband Passing through the deposition zone, sputtering and depositing yttrium-stabilized zirconia; (7) using metal Ce as a sputtering target, pre-sputtering; (8) making the metal substrate pass through the deposition zone, and sputtering and depositing ceria. This method uses water vapor instead of oxygen as the reactive gas. The prepared multilayer isolation layer has a single cubic texture, which meets the needs of epitaxially grown YBCO coatings.

Description

technical field [0001] The invention relates to a continuously grown multilayer cubic texture oxide isolation layer on a metal substrate and a preparation method for the continuously grown multilayer cubic texture oxide isolation layer. Background technique [0002] The Y-series coated conductor is grown YBCO on a flexible metal substrate with a cubic texture isolation layer. This is because the high-temperature superconducting material is an oxide ceramic with poor toughness. To manufacture a long superconducting wire or strip, a flexible metal material must be used as a substrate, and the oxide superconducting material is deposited on the metal substrate. However, many oxide superconducting materials and most metal substrates will react with each other at high temperature, which will affect the superconducting performance. Therefore, adding one or more isolation layers on the metal substrate is to transfer the substrate texture and prevent The metal substrate diffuses to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/06C23C14/34C23C14/54
Inventor 杨坚刘慧舟张华屈飞周其古宏伟
Owner GRIMAT ENG INST CO LTD
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