Unlock instant, AI-driven research and patent intelligence for your innovation.

Test equipment of semiconductor devices

一种检查装置、半导体的技术，应用在单个半导体器件测试、半导体/固态器件测试/测量、测量装置等方向，能够解决价格上涨、试验成本占的比例增加等问题，达到过渡反应速度增加、试验时间缩短、动作噪音的影响降低的效果

Active Publication Date: 2009-09-16
ADVANTEST CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Here, with the increase in the speed of semiconductor devices, the price of semiconductor device inspection equipment such as burn-in equipment and memory testers has risen, and the proportion of test costs in the sales price of semiconductor devices has greatly increased.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Test equipment of semiconductor devices
  • Test equipment of semiconductor devices
  • Test equipment of semiconductor devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] Hereinafter, preferred forms for carrying out the present invention will be described more specifically with reference to the accompanying drawings. Here, in the drawings, the same components are assigned the same reference numerals, and redundant descriptions are omitted. Furthermore, since the description herein is of a preferred form of carrying out the invention, the invention is not limited to this form.

[0050] figure 1 is a conceptual diagram showing an inspection device for a semiconductor device according to an embodiment of the present invention, figure 2 for expressing in figure 1 An explanatory diagram of a test board accommodated in a cavity in an inspection device for a semiconductor device, image 3 for figure 2 A cross-sectional view of the test plate, Figure 4 To show a perspective view of the cooling mechanism mounted on the test board, Figure 5 It is a block diagram showing the functional configuration of the device testing mechanism mounte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An object of the present invention is to provide an inspection device that reduces the test cost of a semiconductor device. The inspection device includes a test board that can be received in the cavity; a recess, a plurality of recesses are installed on the first main surface of the test board, and semiconductor devices constituting the test object are loaded on the recess; a device testing mechanism, multiple A device testing mechanism is installed on the second main surface of the test board, inputs the specified test signal into the semiconductor device, and evaluates the semiconductor device according to the output signal output from the semiconductor device corresponding to the test signal; The exothermic substrate cooled by the test mechanism; the semiconductor device loaded on the recess is heated inside the cavity, and the device test mechanism is cooled by the exothermic substrate, and at the same time, the aging test of the semiconductor device (Burn in test) and characteristic tests.

Description

technical field [0001] The present invention relates to an inspection device for a semiconductor device, and more particularly, the present invention relates to an inspection device for performing a burn-in test for ensuring product reliability and a characteristic test for removing defective products. Background technique [0002] The manufacturing process of semiconductor devices such as semiconductor memory ICs and system LSIs is very complicated and precise, and causes failures in various places. Problems in design, problems in inspection, problems with user's environment, problems in use of the circuit structure, etc. are just like this. In addition, in terms of manufacturing, there are causes of corresponding failures in silicon substrates, diffusion passivation, wiring electrodes, holders, packages, die bonding, wire bonding, sealing, and the like. [0003] In addition, the main failure modes are surface defects (ion contamination, etc.), oxide film defects (pinholes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/02G01R31/26G01R31/28
CPCG11C29/56G01R31/2863G01R31/26H01L22/00
Inventor 宫川末晴池边亮司
Owner ADVANTEST CORP