Lower thermal conductivity heat-barrier material and method for making same
A technology of thermal insulation material and slurry, which is applied to heat exchange equipment, protected pipelines through thermal insulation, mechanical equipment, etc., can solve the problems of low thermal conductivity, inability to meet the requirements of special equipment, and high thermal conductivity of composite thermal insulation materials , to achieve the effect of low thermal conductivity
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Embodiment 1
[0018] Embodiment 1: The components of the heat insulating material are as follows, all in parts by weight:
[0019] 50 parts of basalt fiber, 20 parts of potassium hexatitanate whiskers, binder: 10 parts of starch and 1 part of polyvinyl alcohol, 6 parts of additives composed of polyaluminum chloride and amide in a weight ratio of 1:1.
[0020] The preparation method is as follows:
[0021] Add 50 parts of basalt fiber to 200 parts of water and stir to form a slurry. Subsequently, 20 parts of potassium hexatitanate whiskers were added, and while stirring, 10 parts of starch, 1 part of polyvinyl alcohol, 3 parts of polyaluminum chloride, and 3 parts of amide were successively added. When the liquid in the slurry changes from turbid to clear, the flocs are copied out, molded, and dried at 70°C to obtain a basalt fiber / potassium hexatitanate whisker composite heat insulation board.
[0022] The thermal conductivity of the composite heat insulation board is 0.030W / (m·K) at 200°...
Embodiment 2
[0023] Embodiment 2: As described in Embodiment 1, the difference is that the components are as follows, all in parts by weight:
[0024] 60 parts of basalt fiber, 30 parts of potassium hexatitanate whisker, 8 parts of silica sol, 8 parts of starch, 2 parts of polyvinyl alcohol, 4 parts of polyaluminum chloride, and 3 parts of amide.
[0025] The preparation method is the same as in Example 1, and the silica sol is added to the slurry before the starch and polyvinyl alcohol are added. The obtained composite heat insulation board has relatively high strength, the thermal conductivity at 200°C is 0.036W / (m·K), and the thermal conductivity at 800°C is 0.054W / (m.K).
Embodiment 3
[0026] Embodiment 3: As described in Embodiment 1, the difference is that the components are as follows, all in parts by weight:
[0027] 40 parts of basalt fiber, 10 parts of potassium hexatitanate whisker, 12 parts of starch, 5 parts of polyaluminum chloride, and 3 parts of amide. The thermal conductivity of the obtained composite heat insulating material is 0.033W / (m·K) at 200°C, and 0.052W / (m.K) at 800°C.
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