Chemical machinery grinding composition
A chemical machinery and composition technology, applied in other chemical processes, chemical instruments and methods, electrical components, etc., can solve the problem of not mentioning the use of surfactants, and achieve the effect of reducing the grinding rate and reducing metal residues
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[0091] According to Table 1, at room temperature, 2.00wt% abrasive, 0.05wt% corrosion inhibitor, 0.4wt% adipic acid, 0.2wt% surfactant, metal residue inhibitor and selective addition of formic acid ( The content is as shown in Table 1) was mixed, and then an appropriate amount of aqueous medium was added until the total weight was 100% by weight to prepare a mixture. Then according to the ratio of oxidant:mixture=1:11, mix the mixture and the oxidant, and test whether the pH value is between 3 and 4. If it is not within this pH range, use hydrochloric acid or ammonia to The pH value is adjusted to 3 to 4, and finally the chemical mechanical polishing composition of Examples 1 to 9 is obtained respectively.
[0092] The chemical mechanical polishing compositions of Examples 1 to 9 were tested according to the above-mentioned test and analysis procedures, and the obtained results are summarized in Table 1 below.
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