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Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation

A technology of silicon epoxy resin and epoxy resin, applied in other chemical processes, chemical instruments and methods, electrical components, etc., can solve the problems of low UV resistance and high temperature aging performance, and achieve excellent UV resistance and high temperature aging Performance, improved UV and high temperature aging resistance, excellent optical transparency

Inactive Publication Date: 2009-11-04
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the defects of low UV resistance and high temperature aging performance of the existing epoxy resin packaging materials, and provide a silicone epoxy resin composition with UV and high temperature aging resistance for light-emitting diode packaging, without adding acid anhydride It is a kind of curing agent, and under the action of a small amount of catalyst, the silicone epoxy resin is cured into a highly transparent material, and has excellent UV resistance and high temperature aging resistance

Method used

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  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation
  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation
  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation

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Experimental program
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Effect test

Embodiment 1

[0033] Embodiment 1: the synthesis of organosilicon epoxy resin A

[0034]24.8 grams (0.2 mol) of 4-vinylcyclohexyl 1,2 epoxy compound, 18.0 grams (0.075 mol) of tetramethyltetrahydrocyclotetrasiloxane, and 40 ml of toluene were added to a 300 ml three-necked flask. The temperature of the system is raised to 70-75° C., and 5-10 ppm (based on the total weight of the reactant) chloroplatinic acid catalyst is added to react for 5 hours. After completion of the reaction, 0.002 g of dimercaptobenzothiazole was added and stirred for 10 minutes. Then, the solvent and unreacted reactants were removed with a rotary evaporator at 2 mmHg / 80° C. to obtain 41.6 grams of colorless and transparent epoxy resin A, with a yield of about 97%.

Embodiment 2

[0035] Embodiment 2: the synthesis of silicone epoxy resin B

[0036] 24.8 grams (0.2 mol) of 4-vinylcyclohexyl 1,2 epoxy compound, 24.0 grams (0.1 mol) of tetramethyltetrahydrocyclotetrasiloxane, and 50 ml of toluene were added to a 300 ml three-necked flask. The temperature of the system is raised to 70-75° C., and 5-10 ppm (based on the total weight of the reactant) chloroplatinic acid catalyst is added to react for 5 hours. After completion of the reaction, 0.002 g of dimercaptobenzothiazole was added and stirred for 10 minutes. Then, the solvent and unreacted reactants were removed with a rotary evaporator at 2 mmHg / 80° C. to obtain 46.5 grams of colorless and transparent epoxy resin B, with a yield of about 95%.

Embodiment 3

[0037] Embodiment 3: the configuration of catalyst

[0038] Add 2g bisphenol A epoxy resin and 0.04g aluminum acetylacetonate to a 20ml beaker. Put the beaker in an oven at 120°C, take it out after the aluminum acetylacetonate is dissolved in the epoxy resin, and cool it down to room temperature for later use.

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Abstract

The invention belongs to the field of epoxy resin compositions, and in particular relates to a silicone epoxy resin composition suitable for ultraviolet and high-temperature aging resistance for encapsulating high-power light-emitting diodes. The composition and content of the composition are: 100 parts by weight of silicone epoxy resin whose molecular structure contains at least one Si-H group and one (see the formula on the right) group at the same time, other epoxy resins greater than 0 and less than or equal to 200 parts by weight 0.01-0.1 parts by weight of the catalyst; the catalyst is a β-diketone metal complex, a β-keto lipid metal complex or a mixture thereof. It is formed by blending, pouring and curing. The composition of the invention has excellent optical transparency and excellent anti-ultraviolet and high-temperature aging properties, can be used as a packaging material for light-emitting or optical devices or as an optical adhesive, and is especially suitable as a packaging material for high-power LEDs.

Description

technical field [0001] The invention belongs to the field of epoxy resin compositions, in particular to a silicone epoxy resin composition suitable for high-power light-emitting diode (LED) packaging and anti-ultraviolet and high-temperature aging. Background technique [0002] Due to its high optical transparency, excellent mechanical properties, adhesive properties and process properties, epoxy resin is widely used as a packaging material in the packaging of light-emitting diodes (LEDs). However, for white LEDs, due to the irradiation of ultraviolet rays from blue or purple chips, and the thermal aging caused by the temperature rise of the chip, the performance of epoxy resin will deteriorate during application, such as resin turning yellow, The light transmittance is significantly reduced, thus greatly reducing the service life of the device. This problem is particularly prominent for high-power, high-efficiency white LEDs. This is also one of the key issues in the appl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C09K3/10H01L33/00H01L23/29
Inventor 黄伟余云照袁有学
Owner INST OF CHEM CHINESE ACAD OF SCI
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