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Method of manufacturing a composite of copper and resin

A manufacturing method and composite technology, applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve problems such as reduced adhesion and reduced reliability of semiconductor substrates, and prevent halos , good adhesion and conductivity

Inactive Publication Date: 2009-12-23
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the copper oxide film on the bottom of the via hole is treated with sulfuric acid aqueous solution, etc., but depending on the type of resin in the insulating layer, this may cause halos similar to those in printed wiring boards
Occurrence of the halo leads to a problem of reduced adhesion, and a problem of reduced reliability of the semiconductor substrate

Method used

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  • Method of manufacturing a composite of copper and resin

Examples

Experimental program
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preparation example Construction

[0026] The aqueous phosphoric acid solution of the present invention is prepared as follows. The pH of the obtained phosphoric acid aqueous solution was 2.1.

[0027] Component: content

[0028] Phosphoric acid (85%): 25.35g / L

[0029] Sodium hydroxide aqueous solution: 3.53g / L (calculated as sodium hydroxide)

[0030] Surfactant 1: 5.25g / L

[0031] Surfactant 2: 0.75g / L

[0032] Deionized water: balance

[0033] *Surfactant 1:

[0034] Nona 1912A (polyoxyalkylene aryl phenyl ether) manufactured by Toa Chemical Industries

[0035] *Surfactant 2:

[0036] LAOL XA-60-50 (polyethylene glycol nonyldecylundecyl ether) manufactured by Lion Corporation

[0037] The cleaning treatment was performed by immersing the above-mentioned test panels in an aqueous phosphoric acid solution at 23° C. for 1 minute or 5 minutes. The test panels were washed in water and dried with nitrogen, then the presence of halos was determined by observation with a microscope. The widths of the observ...

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Abstract

A method of manufacturing a metal copper and resin composite, the method comprising forming a copper wiring layer forming an inner layer circuit, disposing an insulating layer containing a resin on the wiring layer, and forming a through hole exposing a copper surface to the Depositing metal under the insulating layer and on the copper surface exposed at the bottom of the through hole, comprising the step of: using an aqueous phosphoric acid solution with a pH of 1-3 to remove the metal formed on the copper surface exposed at the bottom of the through hole Copper oxide. The method suppresses the formation of halos and forms via holes with excellent soldering.

Description

technical field [0001] The present invention relates to a manufacturing method of a composite body having a copper metal layer and an insulating layer on the surface, in particular, to a manufacturing method of a semiconductor substrate having a copper wiring layer (copy wiring layer) on the surface and a cleaning method thereof. Background technique [0002] In the field of electronic materials such as multilayer wiring boards and semiconductor devices, there is a need to reduce the size of semiconductor substrates and printed wiring boards used in electronic devices that are becoming smaller and smaller. In order to meet these demands, printed wiring boards and semiconductor substrates are made denser by making their circuits more complicated and multilayered. A known method for increasing wiring density is to form an insulating layer on the surface of a substrate forming an inner layer circuit, form holes in the insulating layer, and deposit metal in these holes to form c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768H01L21/48H01L21/3213H05K3/46H05K3/38
CPCH05K2203/0315H05K2203/1157H05K3/421H05K2203/0789H05K3/0055H05K3/38H05K3/46
Inventor 近藤正树
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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