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Method of modifying diamond film or natural diamond surface

A technology of surface modification and diamond film, which is applied in the field of diamond application, can solve the problems of unsuitability for composite sheets, decrease of welding strength of interface layer, large difference in thermal expansion coefficient, etc., and achieve good weldability and simple process.

Inactive Publication Date: 2010-04-14
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. When the area of ​​the diamond film is large, due to the large difference between the thermal expansion coefficients of diamond and other materials, the interface layer produces a large stress and the welding strength decreases. Therefore, it is not suitable for making large-area composite sheets, nor can it be compared with the current Compatible with the fabrication technology of PCD diamond tools
[0010] 2. The welding efficiency and yield are very low, which is not suitable for the large-scale production of diamond thick film welding products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1 gives a specific example of surface modification of diamond thick film.

[0025] Select a thickness of 1mm and an area of ​​4cm 2 thick film of diamond, using 200 µm thick Ag 72 Cu alloy flakes, titanium powder with an average particle size of 500nm and a thickness of 10 microns are used as the metal layer, and hexagonal boron nitride powder material is used as the anti-connection layer. After cleaning the diamond thick film and its substrate with alcohol, arrange them in the order of bottom support, anti-connection layer, metal layer, diamond film, and high-temperature-resistant heavy objects from bottom to top, and put them into a vacuum heating furnace. The mass is 1 kg.

[0026] The vacuum heating furnace is evacuated to 2 Pa, filled with hydrogen to 2000 Pa, and the test piece in the vacuum chamber is heated to 900 ° C, and the temperature is maintained for 30 minutes.

[0027] Turn off the power supply for heating the test piece, and slowly lower t...

Embodiment 2

[0028] Embodiment 2 about process condition

[0029] On the basis of Example 1, use 100 microns or 300 microns thick Akg 72 Cu alloy flakes and titanium powder with an average particle size of 100nm or 900nm are used as the metal layer; during the modification process, the vacuum heating furnace is filled with methane to 800Pa, and the test piece is heated to 800°C or 1000°C and kept for 50 minutes. Surface modification of the membrane had no major effect.

[0030] Using talcum powder as the anti-connection layer can also prevent the connection between the base and the thick diamond film.

Embodiment 3

[0031] Example 3 An example of simultaneous single-surface modification of two diamond films.

[0032] In order from bottom to top, the molybdenum sheet base coated with the anti-connection layer, the metal layer, and the diamond film with a thickness of 0.4 mm are used as a unit test piece, and a test piece of the same unit is stacked together, and 1 is added to it. The kilogram weight is put into a vacuum heating furnace. According to the process of Example 1, the surface of the diamond film was modified to obtain two single-surface modified diamond films.

[0033] The modification method of the present invention can also carry out multi-layer modification. That is, in the configuration process, the above-mentioned configuration is used as a modification unit (excluding heavy objects), and a graphite spacer can also be placed between every two modification units, placed in a vacuum heating furnace, and placed on the top heavy objects. Also using the modification process a...

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PUM

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Abstract

The invention discloses a surface modifying method of diamond film or natural diamond, which is characterized by the following: arranging collet, connecting proof layer, metal layer, diamond film or natural diamond particle sequently; applying 20Kpa; placing the unit piece in the vacuum heating furnace; aerating hydrogen or methane as reducing protective gas to 500-3000pa; heating the piece to 800-1000 deg.c; insulating 10-50min.

Description

technical field [0001] The invention belongs to the diamond application field, in particular to a diamond thick film or a process method for modifying the surface of natural diamond. Background technique [0002] Diamond film (CVD diamond) belongs to inorganic non-metallic materials. It is a complete polycrystalline diamond prepared by chemical vapor deposition method. It does not have any metal binder inside. Its physical and chemical properties are close to natural diamond. It has a wide range of applications in fields such as science. Due to the chemical properties of its surface, this material and most metal or alloy solders cannot be wetted very well. Therefore, it is not easy to be firmly welded with hard alloy or metal substrate, which affects the thermal and electronic properties of diamond thick film. Applications in fields such as science and machinery. [0003] The patents related to diamond welding that have been found so far have not yet involved the surface m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/52C04B41/51C04B41/70C04B41/69
Inventor 姜志刚李英爱吕宪义
Owner JILIN UNIV