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Electronic slurry lead-free low melting point glass and preparing method

A low-melting glass, electronic paste technology, applied in glass manufacturing equipment, glass furnace equipment, glass molding, etc., can solve the problems of no cost advantage, can not adapt to lead-free, large thermal expansion coefficient, etc., to achieve excellent chemical Stability, easy adjustment of thermal expansion coefficient, effect of low softening temperature

Inactive Publication Date: 2007-10-24
DONGHUA UNIV
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Problems solved by technology

The softening temperature of the glass is 400-430°C, and the coefficient of thermal expansion is 145-170×10 -7 / °C, although the softening temperature of this glass is suitable for low-melt sealing, but the thermal expansion coefficient of this glass is relatively large, it cannot be used for medium and low expansion coefficient sealing, and it contains a small amount of lead, which cannot meet the requirements of lead-free. Due to the noble metal ZrO 2 The content is relatively high, so there is also no advantage in terms of cost

Method used

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  • Electronic slurry lead-free low melting point glass and preparing method

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Embodiment 1-4

[0033] The present invention will be further described in detail through the composition of specific examples.

[0034] Table 1 (mol%)

[0035]

[0036] The preparation methods of the four lead-free sealing glasses listed in the above Table 1 are the same.

[0037] Weight loss was measured after constant temperature in deionized water at 90°C for 9 hours.

[0038] The coefficient of thermal expansion (α) is measured with a WRP-1 microcomputer thermal dilatometer. The glass sample is a cylindrical sample with a size of 5×25mm. It is raised from room temperature to 300°C with a heating rate of 5°C / min. The glass transition temperature (Tg) was measured with a CRY-IP medium temperature differential thermal analyzer, and the heating rate was 15°C / min. The volume resistivity test sample is a cylindrical glass sample with a diameter of 3 cm and a thickness of 0.5 cm. Wipe with anhydrous alcohol before the test, and then apply conductive graphite emulsion o...

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Abstract

The invention discloses a non-lead low-fusing point glass of electronic slurry, which comprises the following parts: (1) necessary component: 30-55mol% P2O5, 20-55mol% ZnO, 2-10mol% Al2O3, 3-15mol% K2O, 0-1mol%Li2O, (2) adding component: 0-25mol% B2O3, 0-10mol% SiO2, 0-3mol%Fe2O3, 0-8mol%CuO, (3) stable component: not more than 30% two or more oxidizer compounds, wherein allocation of different components is adjusted to obtain the non-lead low-fusing point glass with bulking coefficient at 64-140X10-7 / deg. c and the sealing temperature at 430-600 deg. c.

Description

technical field [0001] The invention belongs to the field of electronic paste glass and its preparation, in particular to an electronic paste lead-free low-melting glass and its preparation method. Background technique [0002] The existing low-melting glass for electronic paste contains a large amount of heavy metal lead. Lead is one of the six metals used by humans at the earliest. It is harmful to human health and can accumulate in the body to cause lead poisoning. The role of lead poisoning Rather slow and stealthy, it is not easy to detect until the toxicity is manifested. Lead is a cumulative poison, which is easily absorbed by the gastrointestinal tract, part of which destroys the blood to decompose red blood cells, and part of it spreads to the organs and tissues of the whole body through the blood and enters the bones. However, lead compounds deposited in internal organs and bone marrow are excreted very slowly from the body, gradually forming chronic poisoning. ...

Claims

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Application Information

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IPC IPC(8): C03C8/24C03C3/19C03C3/17C03C3/066C03B23/20C03B5/23C03B5/235
CPCC03C3/062C03C3/19C03C3/066C03C3/17C03C8/00
Inventor 李胜春陈培
Owner DONGHUA UNIV
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