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Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation

A silicone epoxy resin, epoxy resin technology, applied in other chemical processes, chemical instruments and methods, electrical components and other directions, can solve the problems of low UV resistance and high temperature aging performance, and achieve excellent UV resistance and high temperature aging. performance, reduction of initial coloration or decrease in UV and high temperature aging resistance, effect of improved UV and high temperature aging resistance

Inactive Publication Date: 2007-12-12
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the defects of low UV resistance and high temperature aging performance of the existing epoxy resin packaging materials, and provide a silicone epoxy resin composition with UV and high temperature aging resistance for light-emitting diode packaging, without adding acid anhydride It is a kind of curing agent, and under the action of a small amount of catalyst, the silicone epoxy resin is cured into a highly transparent material, and has excellent UV resistance and high temperature aging resistance

Method used

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  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation
  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation
  • Ultraviolet and high temperature aging resistant organic silicon epoxy resin composition used for luminescent diode encapsulation

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Experimental program
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Effect test

Embodiment 1

[0033] Embodiment 1: the synthesis of organosilicon epoxy resin A

[0034]24.8 grams (0.2 mol) of 4-vinylcyclohexyl 1,2 epoxy compound, 18.0 grams (0.075 mol) of tetramethyltetrahydrocyclotetrasiloxane, and 40 ml of toluene were added to a 300 ml three-necked flask. The temperature of the system is raised to 70-75° C., and 5-10 ppm (based on the total weight of the reactant) chloroplatinic acid catalyst is added to react for 5 hours. After completion of the reaction, 0.002 g of dimercaptobenzothiazole was added and stirred for 10 minutes. Then, the solvent and unreacted reactants were removed with a rotary evaporator at 2 mmHg / 80° C. to obtain 41.6 grams of colorless and transparent epoxy resin A, with a yield of about 97%.

Embodiment 2

[0035] Embodiment 2: the synthesis of silicone epoxy resin B

[0036] 24.8 grams (0.2 mol) of 4-vinylcyclohexyl 1,2 epoxy compound, 24.0 grams (0.1 mol) of tetramethyltetrahydrocyclotetrasiloxane, and 50 ml of toluene were added to a 300 ml three-necked flask. The temperature of the system is raised to 70-75° C., and 5-10 ppm (based on the total weight of the reactant) chloroplatinic acid catalyst is added to react for 5 hours. After completion of the reaction, 0.002 g of dimercaptobenzothiazole was added and stirred for 10 minutes. Then, the solvent and unreacted reactants were removed with a rotary evaporator at 2 mmHg / 80° C. to obtain 46.5 grams of colorless and transparent epoxy resin B, with a yield of about 95%.

Embodiment 3

[0037] Embodiment 3: the configuration of catalyst

[0038] Add 2g bisphenol A epoxy resin and 0.04g aluminum acetylacetonate to a 20ml beaker. Put the beaker in an oven at 120°C, take it out after the aluminum acetylacetonate is dissolved in the epoxy resin, and cool it down to room temperature for later use.

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Abstract

The invention belongs to epoxide resin compound field, especially relating to organosilicon epoxide resin compound which is ultra-violet rseistant and high temperature and aging resistant and suitable for light-emitting diode packing. The comprised component and their content by weight are as follows: molecular structure at least contains one Si- H group and organosilicon epoxide resin 100 units, other epoxide resin of 0- 200 units, catalyst 0.01- 0.1 uint; said catalyst is beta diketone metal complex, beta ketone metal complex or their mixture. The process comprises mixing, injecting, curing and shaping. The product is characterized by good optically transparency and anti- violet and high temperature and aging resistant property, and it can be used for seal packing material for luminous or optical apparatus or light adhesive, especially suitable for seal packing material for large power LED.

Description

technical field [0001] The invention belongs to the field of epoxy resin compositions, in particular to a silicone epoxy resin composition suitable for high-power light-emitting diode (LED) packaging and anti-ultraviolet and high-temperature aging. Background technique [0002] Due to its high optical transparency, excellent mechanical properties, adhesive properties and process properties, epoxy resin is widely used as a packaging material in the packaging of light-emitting diodes (LEDs). However, for white LEDs, due to the irradiation of ultraviolet rays from blue or purple chips, and the thermal aging caused by the temperature rise of the chip, the performance of epoxy resin will deteriorate during application, such as resin turning yellow, The light transmittance is significantly reduced, thus greatly reducing the service life of the device. This problem is particularly prominent for high-power, high-efficiency white LEDs. This is also one of the key issues in the appl...

Claims

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Application Information

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IPC IPC(8): C08L63/00C09K3/10H01L33/00H01L23/29
Inventor 黄伟余云照袁有学
Owner INST OF CHEM CHINESE ACAD OF SCI
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