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Resin composition based on polyimide siloxane

A technology of polyimide siloxane and resin composition, which is applied in the direction of coating, etc., can solve the problems of resin mechanical strength reduction, unsatisfactory solvent removal, and electrical performance degradation, and achieve the effect of preventing corrosion

Inactive Publication Date: 2011-05-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under the high temperature conditions used during the durability test, it became apparent that the above ion exchange resin or chelate resin decomposed itself, and since then ions were present on the electrode surface, a problem of electrode corrosion occurred again
In addition, since the ion exchange resin swells in the presence of solvent, solvent removal during post-treatment is easily unsatisfactory, which leads to a significant decrease in the mechanical strength of the resin, and deterioration in electrical properties

Method used

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  • Resin composition based on polyimide siloxane
  • Resin composition based on polyimide siloxane
  • Resin composition based on polyimide siloxane

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10

[0143] Using the combinations and amounts (parts by mass) shown in Table 3 and Table 4 to mix the compositions comprising polyimidesiloxane and solvent prepared in Synthesis Examples 1-5 above, Synthesis Examples 6-8 above The methoxysilyl-containing bisimide compound prepared in , and tetraisopropoxytitanium as a condensation reaction catalyst: Ti(O-iPr) 4 , and the obtained mixture was thoroughly stirred, thus obtaining the polyimidesiloxane-based resin composition of the present invention.

[0144] Subsequently, the performance of each polyimidesiloxane-based resin composition of Examples 1-10 was evaluated using the following test.

[0145] [Adhesive strength measurement]

[0146] The polyimidesiloxane-based resin composition was applied to a glass substrate and left at 23° C. and 60% humidity for 72 hours to allow the solvent to evaporate, thus forming a tape with a size of 10 mm×150 mm and an average film thickness of 50 μm shape film.

[0147] The lengthwise tip of o...

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Abstract

This invention relates to a resin composition based on polyimide silicone. The said composition comprises (a) Polyamic acid which is a resultant of a tetracarboxylic acid compound, aromatic diamine, and a diamino siloxane which are chosen from a group which comprises an aromatic tetracarboxylic acid compound and an alicyclic tetracarboxylic acid compound, And polymer chosen from a group which comprises polyimide silicone which is a ring closure derivative of this polyamic acid, (b) a solvent; and (c) reactive-silyl-groups diimide compound with imide ring derivated from diimide compound containing phenolic hydroxyl group and alkoxyl silyl group. The said composition is used for electrode protective material to prevent the surface of the electrode from corroding and display excellent binding to the basis material.

Description

technical field [0001] The present invention relates to a polyimidesiloxane-based resin composition suitable for use as an electrode protection material in electronic components, and also to an electrode protection material comprising such a composition. Background technique [0002] Polyimide resins, which exhibit excellent heat resistance as well as excellent electrical and mechanical properties, are generally widely used as resins for forming insulating protective films of electronic components and the like. During the formation of these protective films, since polyimide resins are generally insoluble in organic solvents, a method is employed which uses a solution of polyamic acid which is a precursor of polyimide resins, and this The solution is applied to the substrate and then heated, thereby causing ring closure and forming a coating of the target polyimide resin through a dehydration condensation reaction. [0003] However, there are various problems in using these ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K5/20C08J5/18
CPCC08G73/1007C08K5/20C08L83/10C08L2203/206C09D179/08
Inventor 市六信广横尾明男
Owner SHIN ETSU CHEM IND CO LTD
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