Preparation method of UV-barrier copper-clad plate

A technology of copper cladding and processing method is applied in the field of preparation of UV blocking copper clad laminates, which can solve the problem that high-performance new copper clad laminates cannot meet market demands, and achieve the effects of low production cost, good UV blocking function and high production efficiency.

Inactive Publication Date: 2008-02-06
义乌市先通电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper-clad laminates currently produced in China are mainly medium and low-grade ordinary boards, and the new high-performance copper-clad laminates cannot meet the needs of the domestic market.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0017] (4) Specific embodiments: the following examples can make those skilled in the art understand the present invention more comprehensively, but do not limit the present invention in any way.

Embodiment

[0019] Preparation method of UV blocking copper clad laminate:

[0020] (1) Electronic grade glass fiber cloth (substrate material) can be selected arbitrarily:

[0021] Type 7628 Thickness 0.2mm

[0022] Type 2116 Thickness 0.1mm

[0023] 1080 type thickness 0.045mm

[0024] (2) Glue formula: 1935 grams of brominated epoxy resin, 63 grams of four-functional resin, 102 grams of silica powder, 92 grams of 2MI (dimethylimidazole), 456 grams of DMF (dimethylformamide), DCD (double cyanamide) 45.6 grams, acetone 100 grams;

[0025] (3) Glue adjustment: Brominated epoxy resin, 2MI, DMF, silicon micropowder, DCD, acetone are mixed according to the above weight ratio, continuously and uniformly stirred in the glue tank, after aging for 6-8 hours, add four-functional resin and Continue to stir evenly for 2 to 4 hours;

[0026] (4) Gluing: After the electronic grade glass fiber cloth is soaked in the glue solution, it is dried in an oven at 180-200 °C, and the dried film (PP sheet...

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Abstract

The present invention discloses a preparation method for a UV blocking and covering copperplate. In the method, an electronic grade glass fibre cloth is used as the substrate material, and the electronic grade glass fibre cloth is saturated in fully milled and curing glue solution which is mainly made of brominated epoxide resin, four-functional resin, acetone, 2MI, DCD and silicon micro powder, and then the electronic grade glass fibre cloth is dried and sliced up, after chip selecting, folding and matching, and covering clutch gold on the surface according to the requirements of products, the electronic grade glass fibre cloth is pressed and molded in a vacuum hot-press. The UV blocking and covering copperplate product provided by the present invention, has the function of screening ultraviolet light and meeting AOI optics, and can meet the requirements of improving the productivity effect and guaranteeing the product quality, and can realize the continuous production, no pollution, and low production cost.

Description

(1) Technical field: [0001] The invention belongs to the field of polymer materials and electronic composite materials, and in particular relates to a method for preparing a UV-blocking copper-clad laminate. (two) background technology: [0002] With the rapid development of electronic information technology and the improvement of people's living standards, household appliances, mobile phones, computers, medical equipment, military facilities and instruments have higher and higher requirements for printed circuit board materials. Printed circuit board (PCB) The circuit density is increasing continuously, and the circuit processing requirements are becoming more and more precise, which promotes the development and wide application of solder mask (or solder mask) technology and photo solder mask technology for printed boards. However, when the ultraviolet light (UV) used in imaging passes through the solder mask or the laminate substrate, there will usually be mutual influence...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/09
Inventor 王青云
Owner 义乌市先通电子材料有限公司
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