Direct-writing lithography device with focusing device

Abstract

The utility model relates to photolithography technical field, which solves the problems of the direct writing photolithography apparatus that the abaxial focus of the optic positioning and detecting system and exposal and projection system with different lenses requires respective displacement correction. The utility model is characterized in that a focus system is added between an optic light-collector and a programmable graphic dust emitter; wherein, the focus optical wavelength beam splitter is arranged between the optic light collector and the programmable dust emitter; the focus light collector and the focus light source arranged above the focus optical wavelength beam splitter in sequence. The utility model directly utilizes the variable-rate projection lens to coaxial project focus graphics to accomplish the coaxial focus of different lenses and avoid the requirement of the abaxial focus for the separated displacement rectification process so as to improve the efficiency and reduce the cost of the abaxial focus apparatus. Besides, the utility model also accomplishes the real-time distance-rectification of the change of the focal surface which is caused by the conversion to the projection lens, and accomplishes the real-time contraposition detecting of the existing graphics on the wafer as well.

Description

technical field [0001] The present invention relates to the technical field of lithography, in particular to a direct-write lithography device for printing patterns on substrates such as wafers, printed circuit boards, mask plates, flat panel displays, biological wafers, micromechanical electronic wafers, and optical glass flat plates . Background technique [0002] Photolithography is used to print a pattern of features on the surface of a substrate. Such substrates may include substrates used in the fabrication of semiconductor devices, various integrated circuits, flat panel displays (eg, liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. Frequently used substrates are semiconductor wafers or glass substrates. [0003] During lithography, a wafer is placed on a wafer stage, and a pattern of features is projected onto the wafer surface by an exposure device within the lithography apparatus. A...

AI Technical Summary

Problems solved by technology

Among them, the laser beam direct writing method is point-by-point exposure, using high-energy laser to directly generate graphics on the light-sensitive substrate, the processing speed is slow, and the exposure time of a single wafer is long; the second method uses a computer-controlled pattern generator (SLM) to generate area One-time exposure to the corresponding giant domain on the light-sensitive substrate, the main problem is that the resolution is low, and it is limited by the shape of the unit pixel and the effective fill-in factor. Difficulty making continuous smooth graphic outlines

[0008] In order to solve the problem of low efficiency of the existing step-by-step direct-write lithography technology and the difficulty of continuous scanning lithography operation of a single pixel, Chinese patent application 200720037805.9 discloses a comprehensive direct-write lithography device

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