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Pattern forming material and pattern forming method

A patterning, biimidazole technology, applied in the field of pattern forming materials, can solve the problems of excellent stability over time, poor resolution and adhesion, less development residue, etc., to achieve excellent adhesion and sensitivity, long-lasting Excellent stability and less development residue

Inactive Publication Date: 2012-02-08
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, as the hexaarylbiimidazole compound having such a hydrophilic group, it is preferable to use a compound further having a chlorine atom from the viewpoint of realizing high sensitivity, but even in this case, even if digital exposure exceeds 20mJ / cm 2 Sensitivity is not necessarily high, so there are still problems of poor resolution and adhesiveness in the obtained pattern
[0006] On the other hand, in the case of using hexaarylbiimidazole having a hydrophilic group, if the coating solution containing a photosensitive composition using a hydrophilic polymer as a binder is left for about 7 days, If the color developer such as leuco crystal violet gradually develops color, the sensitivity of the pattern forming material decreases, and the stability of the sensitivity over time is poor.
In addition, hexaarylbiimidazole having a chlorine atom has high crystallinity, and a coating liquid containing a photosensitive composition using this hexaarylbiimidazole crystallizes during storage at low temperature, which also causes a decrease in sensitivity.
[0007] Therefore, there has not yet been provided a pattern forming material capable of forming a high-sensitivity and high-resolution pattern, excellent adhesion and sensitivity over time, less developing residue, and a high-definition pattern, and a pattern-forming material using the same. The pattern forming method needs to be further improved and developed

Method used

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  • Pattern forming material and pattern forming method
  • Pattern forming material and pattern forming method
  • Pattern forming material and pattern forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0325] — Manufacture of pattern forming materials —

[0326] As the support, a photosensitive composition solution consisting of the following composition was applied and dried to a PET (polyethylene terephthalate) film (manufactured by Toray Co., Ltd., 16FB50) with a thickness of 16 μm to form a thick A 30 μm photosensitive layer was then laminated with a 25 μm thick polyethylene film on the photosensitive layer using a laminator to manufacture the pattern forming material.

[0327] [Composition of Photosensitive Composition Solution]

[0328] ・Methacrylic acid / methyl methacrylate / styrene / benzyl methacrylate copolymer (copolymer composition (mass ratio): 25 / 8 / 30 / 37, mass average molecular weight: 68,800, Tg: 105°C) …17.5 parts by mass

[0329] · A polymerizable monomer represented by the following formula M-1...6.0 parts by mass

[0330] ・1 / 2 molar ratio adduct of decamethylene diisocyanate and tetraoxyethylene monomethacrylate ... 6.0 parts by mass

[0331] · Trimethylol...

Embodiment 2

[0401] In Example 1, 2,2',5-tri-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenyl-bis Imidazole is replaced by 2.2 parts by mass of 2,2',4,4'-tetra-(o-chlorophenyl)-5,5'-(3,4-dimethoxyphenyl)-bidiimidazole, in addition , in the same manner as in Example 1, evaluations of sensitivity, resolution, adhesiveness, storage stability, presence or absence of development residue, and hiding properties were performed. The results are shown in Table 1.

Embodiment 3

[0403] In Example 1, 2,2',5-tri-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenyl-bis Imidazole is replaced by 2,2'-bis-(o-chlorophenyl)-4,4',5,5'-tetra-(m-methoxyphenyl)-1,2-biimidazole, 2,2' - 2.6 parts by mass of bis(2-ethoxyphenyl)-4,4',5,5'-tetraphenyl-1,1'-bidiimidazole, except that the sensitivity was carried out in the same manner as in Example 1 , resolution, adhesiveness, storage stability, presence or absence of developing residue and evaluation of covering properties. The results are shown in Table 1.

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Abstract

The object of the present invention is to provide a pattern forming material capable of forming high-sensitivity and high-resolution patterns, excellent adhesion and sensitivity over time, less development residue, and high-definition patterns, and a pattern using the pattern-forming material. form method. The present invention is formed on a support with a photosensitive layer composed of a photosensitive composition containing at least a binder, a polymerizable compound and a photopolymerization initiator, and the binder contains an I / O value of 0. A polymer of 300 to 0.650, a pattern forming material in which the photopolymerization initiator contains a hexaarylbiimidazole compound having a hydrophilic group, and a pattern forming method using the pattern forming material.

Description

technical field [0001] The present invention relates to a pattern forming material suitable for dry film resist (DFR) and a pattern forming method using the same. Background technique [0002] In the field of printed wiring boards, copper wiring patterns are generally first formed on copper-clad laminates using DFR. At this time, an adhesive-forming material composed of a photosensitive composition containing an adhesive, a polymerizable compound, a photopolymerization initiator, etc. is used (refer to International Publication No. ). [0003] Exposure to the pattern forming material is usually performed using a mask, but in recent years, from the viewpoint of productivity, resolution, etc., the use of digital micromirror device (digital micromirror device) (DMD) using laser A maskless exposure apparatus is also being actively developed. [0004] Among the above-mentioned pattern-forming materials, in order to reduce development residues, a pattern-forming material using ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/00
Inventor 高岛正伸
Owner FUJIFILM CORP