Temperature gradient controllable wafer front-drying method and its hot plate type front drying device

A temperature gradient and wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as the inability to directly control the wafer temperature, and achieve excellent photolithographic effects, high integration, and excellent film properties.

Inactive Publication Date: 2008-03-19
SHENYANG KINGSEMI CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0009] In order to overcome the deficiency that the existing traditional HP hot plate cannot directly control the wafer temperature and obtain the best photoresist quality adhesive film in the pre-baking process, the purpose of the present invention is to provide a p

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  • Temperature gradient controllable wafer front-drying method and its hot plate type front drying device
  • Temperature gradient controllable wafer front-drying method and its hot plate type front drying device
  • Temperature gradient controllable wafer front-drying method and its hot plate type front drying device

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Embodiment Construction

[0043] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0044] As shown in Figures 2 and 9, in the semiconductor chip manufacturing process, the hot plate type pre-baking device used for pre-baking after coating the photoresist on the wafer includes a hot plate body 4, a heater 11 and a temperature detection device 9 1. The body of furnace with four walls surrounded by the frame has three vertical needle rods for supporting the wafer 12, and also includes a lift mechanism (such as screw mandrel 5, motor 7 and encoder 6) and servo driver 8 etc., wherein: be provided with heater (can be rod-shaped or sheet structure) and chip temperature detecting device 9 (such as: Pt100 thermal resistance or thermoelectric coupler) in the hot plate body, respectively with heat Disc temperature controller 10 (prior art, commercially available) is electrically connected; Ejector pin 3 is located on the heating disc body 4, is connec...

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Abstract

The present invention relates to a prebaking method and a hot disk-type prebaking device for chips, the temperature gradient of the present invention is controllable; the method is through adopting fuzzy control theory and three closed-loop approach of the temperature of a hot disk, the position and temperature of a chip, the position changing of the chip in the hot disk can be accurately traced and the temperature gradient and changing process of a glue film on the chip can be controlled; the device comprises a furnace body, a hot disk body, a heater and a temperature detection device, a chip top rod, a lifting mechanism; the furnace body has an upper cover with an extracting opening and a door for the chip accessing; the hot disk body is arranged in the furnace body; a heater and a temperature detection device are arranged in the hot disk body and connected electrically with the hot-disk temperature controller; the chip top rod is arranged on the hot disk body and the bottom of the chip top rod goes through the hot disk body and to connect the lifting mechanism; the output shaft of the lifting mechanism which is connected with a servo controller by a motor is provided with a coder which is connected with the bottom of the top rod by a leadscrew; the present invention can strictly control temperature, time and warming speed, and can gain the best characteristics of glue film and best lithography effects and finally can produce semiconductor devices with high integration level and high reliability.

Description

technical field [0001] The invention relates to semiconductor integrated circuit chip manufacturing technology, and specifically describes a pre-baking method with controllable temperature gradient and a hot-disk type pre-baking device. technical background [0002] In the manufacturing process of semiconductor integrated circuit chips, it is necessary to use photolithography, a micro-processing method, to repeatedly groove, open windows, punch holes, and build platforms on various thin films of the substrate. processing. The prerequisite for ensuring the precision of photolithographic microfabrication is to accurately transfer the pattern to be processed to the substrate. The pattern transfer accuracy is completely determined by the photolithographic effect. The medium of pattern transfer is photocorrosion agent, commonly known as photoresist; the formation of a good film depends first on the performance of the coating equipment, and the pre-baking after coating also plays...

Claims

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Application Information

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IPC IPC(8): G03F7/38H01L21/00
Inventor 于海川程金胜张军
Owner SHENYANG KINGSEMI CO LTD
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