Flexible transparent polyimide film material and method for producing the same

A technology of transparent polyimide and film materials, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor mechanical strength of polyimide films and achieve good light transmittance

Active Publication Date: 2008-06-11
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this kind of perfluorinated polyimide is orange or brown, so the use of high fluorinated raw materials does not necessarily result in colorless polyimide
Moreover, the mechanical strength of this highly fluorinated polyimide film is poor

Method used

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  • Flexible transparent polyimide film material and method for producing the same
  • Flexible transparent polyimide film material and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1 Dissolve 6.4052 g of TFDB (0.02 mol) into 57.8 g of dimethylacetamide at room temperature, mechanically stir until TFDB is completely dissolved, then add 8.0464 g of HQDPA (0.02 mol) to the above solution under stirring. Stirring was continued for 48 hours to form a polyamic acid paint with a solid content of 20 wt%.

[0023] Place the formed polyamic acid paint statically for 24 hours until the air bubbles are eliminated, cast it on a clean glass plate, put it in a drying film box and bake it at 80°C for 2 hours, and after the solvent evaporates and the film is cured, apply the polyamic acid paint The glass plate of the polyimide film is moved into a high-temperature oven, and the high-temperature oven is processed from room temperature to 350° C. at a heating rate of 2° C. / min. Then turn off the high-temperature oven and make the temperature drop to room temperature naturally, take out the glass plate coated with polyimide from the oven, put it into water an...

Embodiment 2

[0024] Example 2 Dissolve 4.5266 g of DMMDA (0.02 mol) into 50.3 g of dimethylformamide at room temperature, mechanically stir until DMMDA is completely dissolved, then add 8.0464 g of HQDPA (0.02 mol) to the above solution under stirring. Stirring was continued for 48 hours to form a polyamic acid paint with a solid content of 20 wt%.

[0025] Place the formed polyamic acid paint statically for 24 hours until the air bubbles are eliminated, cast it on a clean glass plate, put it in a drying film box and bake it at 80°C for 2 hours, and after the solvent evaporates and the film is cured, apply the polyamic acid paint The glass plate of the polyimide film is moved into a high-temperature oven, and the high-temperature oven is processed from room temperature to 350° C. at a heating rate of 2° C. / min. Then turn off the high-temperature oven and make the temperature drop to room temperature naturally, take out the glass plate coated with polyimide from the oven, put it into water ...

Embodiment 3

[0026] Example 3 Dissolve 4.9662 grams of DDS (0.02mol) into 52.1 grams of γ-butyrolactone at room temperature, and stir mechanically for 2 hours. After the DDS is completely dissolved, add 8.0464 grams of HQDPA (0.02mol ). Stirring was continued for 48 hours to form a polyamic acid paint with a solid content of 20 wt%.

[0027] Place the formed polyamic acid paint statically for 24 hours until the air bubbles are eliminated, cast it on a clean glass plate, put it in a drying film box and bake it at 80°C for 2 hours, and after the solvent evaporates and the film is cured, apply the polyamic acid paint The glass plate of the polyimide film is moved into a high-temperature oven, and the high-temperature oven is processed from room temperature to 350° C. at a heating rate of 2° C. / min. Then turn off the high-temperature oven and make the temperature drop to room temperature naturally, take out the glass plate coated with polyimide from the oven, put it into water and boil the wa...

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Abstract

The invention relates to a flexible transparent medlin membrane material and a relative preparation method, wherein the invention polymerizes 4, 4'-bis(3', 4'-dicarboxyphenoxy), 2, 2'-bis(trifluoromethyl)-4, 4'-benzidine, 3, 3'-diaminodiphenylsulfone dapsone and 3, 3'-dimethyl-4, 4'-diamino diphenyl methane in polar solvent to obtain medlin, uses tape casting method to treat the medlin on a clean glass plate, bakes in a membrane bake oven at 80DEG C for 2h until the solvent is volatilize and the membrane is solidified, moves the glass plate coated with a medlin membrane into an oven, increases the oven temperature from room temperature to 350DEG C at the heating rate of 2DEG C/min, naturally cools to room temperature, takes out the glass plate coated with one medlin membrane from the oven, arranges the glass plate into water, boils water to remove the medlin membrane from the glass plate, to obtain flexible transparent medlin membrane material. The ultraviolet cut-off wavelength of the medlin membrane is 395-430nm, and the glassivation transformation temperature is 254-280DEG C.

Description

technical field [0001] The invention relates to a flexible transparent polyimide film material and a preparation method. Background technique [0002] In recent years, flexible substrate amorphous silicon solar cells have been paid more and more attention. It can be bent arbitrarily, is easy to install and carry, and has been widely used in aviation and aerospace fields. It is an indispensable energy component for adjacent space powered airships. [0003] Since the substrate of amorphous silicon solar cells on metal substrates is opaque, transparent conductive films can only be deposited on amorphous silicon films. film, thereby reducing the conversion efficiency of the battery. Using a transparent polymer film as the substrate, forming an ITO transparent conductive film, amorphous silicon, and aluminum electrode structure on the surface of the substrate film can make the light irradiate the amorphous silicon layer with high efficiency, thereby obtaining high photoelectric...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18H01L31/02
Inventor 朱丹阳杨正华张春华吴作林魏玉兰
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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