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Halon-free intumescent fire-retardant epoxy resin compound

A technology of epoxy resin and composition, which is applied in the field of halogen-free intumescent flame-retardant epoxy resin composition, can solve the problems such as the influence of basic performance of epoxy resin, and achieve the effect of low hygroscopicity and smooth surface

Inactive Publication Date: 2008-06-18
SHANGHAI RES INST OF CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current general-purpose inorganic flame retardants must be added in large quantities to achieve the corresponding flame retardant effect. At this time, the basic properties of the epoxy resin will be affected to a certain extent. Therefore, people are looking for a phosphorus-nitrogen system. Halogen-free intumescent flame retardants to solve the above problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The combination of the composition is: bisphenol A epoxy resin 65kg, ammonium polyphosphate 18kg, melamine cyanurate 23kg, triphenylphosphonate 10kg, triethylenetetramine 7.5kg, phenyl glycidyl ether 3kg, silica fume Stone 1kg and zinc oxide 0.5kg. The above raw materials were fully mixed in a high-speed mixer, and cured at room temperature for 10 hours, at 60° C. for 9 hours and at 130° C. for 10 hours to obtain a cured product of a halogen-free intumescent flame-retardant epoxy resin composition. The obtained samples were tested and the results are shown in Table 1.

Embodiment 2

[0019] Except that bisphenol S epoxy resin was replaced by bisphenol A epoxy resin, all component proportions and process conditions were the same as in Example 1. The obtained samples were tested and the results are shown in Table 1.

Embodiment 3

[0021] Except that 25kg of cyanuric acid epoxy resin and 40kg of bisphenol F epoxy resin were substituted for bisphenol A epoxy resin, all the other component proportions and process conditions were the same as in Example 1. The obtained samples were tested and the results are shown in Table 1.

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PUM

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Abstract

A halogen-free expansion flame-retardant epoxy resin combination mainly includes the following components (in terms of weight portion) 45 to 85 portions of epoxy resin, 4 to 40 portions of ammonium polyphosphate, 2 to 30 portions of melamine or the derivatives, 1 to 20 portions of phosphonate ester, 1 to 13 portions of solidified agent, 0.1 to 8 portions of diluting agent and 0.1 to 4 portions of filling agent. The combination with no halogen, strong moisture resistance and good flame retardance can reach V-0 standard in UL-94; therefore, the combination is used as the substrate of manufacturing spare parts and fittings in the electronic and electric field.

Description

technical field [0001] The invention relates to a composition with high molecular polymer as the main material. This composition is very suitable as a material for manufacturing various equipment in the field of electronics and electricity. Specifically, it relates to a composition with epoxy resin as the matrix. Intumescent flame retardant composition without halogen type flame retardant. Background technique [0002] Epoxy resin has good physical and mechanical properties, excellent adhesion, electrical insulation and dimensional stability, so it has always been the most widely used matrix resin in the field of electronic and electrical equipment. In recent years, with the development of equipment technology in the electrical and electronic field, high requirements have been put forward for the flame retardancy of epoxy resin. So far, the flame retardants used in epoxy resins are mainly halogen flame retardants and halogen-free flame retardants, and the halogen-free flame...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/5373C08K5/3492C08K5/17C08K5/521C08K3/00
Inventor 刘彦明郝东梅尹亮陈崇伟
Owner SHANGHAI RES INST OF CHEM IND
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