Mildew resistant antimicrobial type low corrosion water-based scaling powder

A technology of anti-mildew and anti-bacterial agent and corrosive water, which is applied in the field of anti-mold and anti-bacterial low-corrosion water-based flux, can solve the problems of affecting solderability, the impact is not particularly large, and microbial residues affect conductivity, etc., to achieve The effect of large market potential

Inactive Publication Date: 2008-08-13
PERFECTION SCI & TECH DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional fluxes are mainly organic solvent-based, using alcohols with low boiling points (such as methanol, ethanol, isopropanol, etc.) May also cause adverse effects on the environment and human body
In recent years, people have begun to develop fluxes that use water as a solvent matrix, that is, "water-based fluxes", which have t...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: citric acid 1.8%

[0019] Succinic acid 0.3%

[0020] Triethanolamine 0.8%

[0021] Oil-soluble polyacrylate 5.8%

[0022] Laurylphenol ethoxylate 0.3%

[0023] Ethylene glycol chitosan 0.01%

[0024] Deionized water 90.99%

Embodiment 2

[0025] Embodiment 2: citric acid 2.0%

[0026] Triethanolamine 0.8%

[0027] Oil-soluble polyacrylate 5.6%

[0028] Laurylphenol ethoxylate 0.3%

[0029] Ethylene glycol chitosan 0.01%

[0030] Deionized water 91.29%

Embodiment 3

[0031] Embodiment 3: citric acid 1.8%

[0032] Malic acid 0.3%

[0033] Diethylenetriamine 0.6%

[0034] Oil soluble polyacrylate 5.4%

[0035] Laurylphenol ethoxylate 0.25%

[0036] Ethylene glycol chitosan 0.01%

[0037] Deionized water 91.64%

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PUM

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Abstract

The invention relates to soldering fluid technique, which is a modified technique based on prior art, specifically relates to a mildew resistant antibiotic low-corrosivity water-based soldering fluid, comprising components with following percentage by weight (): 1.0% of active agent, 1.0% of micro-enwrapping agent, 0.1% of surfactant, 0.01% of mildew resistant antibiotic agent, residue is solvent of de-ionized water, and the weight sum of each components are 100 The advantages of the invention are: the soldering fluid contains no volatile organic matter or halide, and can inhibit development of microorganisms such as bacteria and fungi and mildew; circuit and conveyor are not eroded during welding, no cleaning is needed after welded, and the soldering fluid is safe and environmentally-friendly; the soldering fluid can be coated on the PCB plate weld face by spraying, dipping or foaming mode to implement leadless welding of electronic products. The invented soldering fluid is practical and has great market potential.

Description

technical field [0001] The invention relates to the technical field of soldering flux and is an improvement on the prior art, in particular to a mildew-proof and antibacterial low-corrosion water-based soldering flux. Background technique [0002] In the field of electronic brazing, flux is a very important auxiliary material. Traditional fluxes are mainly organic solvent-based, using alcohols with low boiling points (such as methanol, ethanol, isopropanol, etc.) It may also cause adverse effects on the environment and human body. In recent years, people have begun to develop fluxes that use water as a solvent matrix, that is, "water-based fluxes", which have the advantages of environmental protection, no-cleaning and safety, but they severely corrode circuit boards and conveyor belts during lead-free soldering. In addition, the growth of microorganisms (such as bacteria, fungi, and molds) not only affects solderability, but also the microbial residues after welding affect...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 徐安莲罗泳邓小安
Owner PERFECTION SCI & TECH DONGGUAN
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