Monodisperse high-performance conductive silver particle

Abstract

The invention relates to a high performance conductive silver particle for fine pitch connection. The conductive particle takes mono-disperse resin particle as the matrix and adheres with nickel and silver layers on the surface, which leads the particle to have good conductivity. By dispersing the conductive particle in bonding materials, an anisotropic conductive adhesive can be obtained. The adhesive can be used in the fine pitch connection of cable wiring on distribution frame, and is mainly used for replacing conductive nickel powder with the advantage of extremely high reliability of conductivity.

Description

technical field [0001] The invention relates to a high-performance conductive silver particle for fine-pitch connection. Background technique [0002] With the rise of high-density wiring technology, gold, silver, copper, and nickel metal powders with low resistivity have been used as anisotropic conductive fillers for fine-pitch connections, followed by silver, copper, and nickel as the core , gold-plated conductive particles on the surface. The conductive filler is mainly dispersed in the matrix in a spherical or irregular shape, forming an anisotropic circuit conduction. Commonly used fillers are mostly metal powders such as gold, silver, copper, and nickel with low resistivity. Gold powder has the best resistivity, but it is expensive. [0003] So far, in the civilian low-end field, fine-pitch connections (such as zebra paper) that are not very demanding on the process generally use relatively cheap ultra-fine nickel powder or copper powder or use relatively high-price...

AI Technical Summary

Problems solved by technology

However, due to the wide particle size distribution of the above ultrafine metal powders and different particle shapes, and the high resistance of nickel powder and copper powder, silver powder will pr

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