Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy resin electronic packaging material and electronic component packaged with the same

An electronic packaging material and epoxy resin technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unsatisfactory heat resistance and moisture absorption, and achieve the effect of improving heat resistance and water absorption resistance

Inactive Publication Date: 2012-12-12
3M INNOVATIVE PROPERTIES CO
View PDF2 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as an electronic component packaging material, the heat resistance and moisture absorption of conventional epoxy resin packaging materials cannot meet the technical requirements of current electronic packaging materials.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin electronic packaging material and electronic component packaged with the same
  • Epoxy resin electronic packaging material and electronic component packaged with the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Slowly add 0.92 parts by weight of nano silicon dioxide (with a particle size of 30 to 40 nanometers) into the? In milliliter of ethylene glycol (industrial grade), after stirring gently, the mixture was stirred at a high speed of 4000RPM for 30min on a high-speed mixer (model: U400 / 80-220) until the mixture was translucent, and the Suspension.

[0066] 21.6 parts by weight of solid bisphenol A epoxy resin (trade name DER671, purchased from Dow Chemical Company) and 9.3 parts by weight of phenolic modified epoxy resin (trade name DER642U, purchased from Dow Chemical Company) were mixed uniformly , Stir fully on a heating and stirring device at 200°C until the resin mixture is fully melted, slowly add the above suspension into the molten resin being stirred, and then stir evenly for 60 minutes. During the melt mixing process, the ethylene glycol is completely evaporated.

[0067] The mixture was poured out, cooled and crushed to form a powder.

[0068] All the powders...

Embodiment 2-4

[0070] Prepared by the same method as described in Example 1, the difference is that the amount of each component is the amount shown in Table 1. The unit of the consumption of each component in Table 1 is parts by weight.

[0071] Table 1

[0072]

preparation Embodiment 1-5 and comparative preparation example 1

[0076] Pour the epoxy powders prepared in Examples 1-5 and Comparative Example 1 into the fluidized bed respectively, adjust the size of the airflow until the air bubbles on the liquid surface of the fluidized powder are even, and preheat the powder in a 150°C oven (model: UT20). Dip-coat the resistance sheet heated for 30 minutes in the fluidized bed 2 to 3 times, each time for 1 to 2 seconds. Put it back into an oven at 150°C and cure for 60 minutes. Like this, just obtain the resistor chip after encapsulating with above-mentioned epoxy powder, as figure 1 shown. Six resistor chips were prepared with the epoxy resin powders prepared in Examples 1-5 and Comparative Example 1 respectively.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
softening pointaaaaaaaaaa
softening pointaaaaaaaaaa
Login to View More

Abstract

The invention provides an epoxy resin electronic packing material which consists of following components: a) 25 to 50 weight percent of epoxy resin; b) 0.5 to 5 weight percent of nanometer silicon dioxide particles; c) 35 to 55 weight percent of inorganic fillers; d) 10 to 25 weight percent of epoxy resin firming agents and e) 0 to 25 weight percent of at least one component selected from flame retardants, flatting agents, catalysts and pigments and the total weight of the components a) to d) is taken as the standard. By uniformly dispersing the nanometer silicon dioxide particles in the conventional epoxy resin electronic packing material, the heat resistance and water absorption resistance of the epoxy resin electronic packing material are greatly improved. . The invention also provideselectronic elements packed by the epoxy resin electronic packing material of the invention.

Description

technical field [0001] The invention relates to an electronic packaging material and an electronic component encapsulated by it, more particularly to an electronic component encapsulated by an epoxy resin electronic packaging material. Background technique [0002] Epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in coatings, adhesives, and electronic packaging materials. However, as an electronic component packaging material, the heat resistance and moisture absorption of conventional epoxy resin packaging materials cannot meet the technical requirements of current electronic packaging materials. In recent years, semiconductor mounting has begun to change from the pin insertion type to the surface mounting type, and solder cracking during mounting has become a major problem. The so-called solder cracking means that during installation, the moisture-absorbing semiconductor package is subjected to a high-temperature s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L63/04C09K3/10H01L23/29
Inventor 吴丹平
Owner 3M INNOVATIVE PROPERTIES CO