Electrostatic protection component, and electronic component module using the same

A technology for electronic components and resistance parts, applied in electrical components, electric solid state devices, circuits, etc., can solve the problems of no heat dissipation mechanism, difficult heat dissipation of light-emitting diodes, etc., and achieve thinning, excellent electrostatic pulse resistance, and heat dissipation. excellent effect

Inactive Publication Date: 2008-09-17
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, chip-type devices with a relatively small package shape do not have a heat dissipation mechanism and use

Method used

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  • Electrostatic protection component, and electronic component module using the same
  • Electrostatic protection component, and electronic component module using the same
  • Electrostatic protection component, and electronic component module using the same

Examples

Experimental program
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Effect test

Example Embodiment

[0035] Embodiment 1

[0036] figure 1 It is an external perspective view of the electrostatic protection component according to Embodiment 1 of the present invention. figure 2 It is a cross-sectional view taken along line 2-2 of the electrostatic protection component of the present embodiment. image 3 It is a cross-sectional view taken along line 3-3 of the electrostatic protection component of this embodiment. Figure 4 It is a schematic exploded perspective view of the electrostatic protection component of this embodiment. Figure 5 It is a cross-sectional view of the light-emitting diode module of this embodiment. Figure 6 It is an equivalent circuit diagram of the light emitting diode module of this embodiment.

[0037] Such as figure 1 , figure 2 , image 3 with Figure 4 As shown, the electrostatic protection component of this embodiment has a variable resistance portion 10 formed by alternately stacking three variable resistance layers 10a, 10b, and 10c and internal ...

Example Embodiment

[0067] Embodiment 2

[0068] The difference between the second embodiment and the first embodiment is that, in the first embodiment, the external electrodes 16a and 16b are formed on the surface of the ceramic substrate 12 where the terminal electrodes 13a and 13b are not formed. External electrodes 16a and 16b are formed on the side surfaces of the variable resistance part 10 and the ceramic substrate 12.

[0069]Hereinafter, an electrostatic protection component and a light emitting diode module according to Embodiment 2 of the present invention will be described.

[0070] Picture 12 It is an external perspective view of the electrostatic protection component of this embodiment. Figure 13 Is the electrostatic protection component of this embodiment Picture 12 Sectional view of A-A’. Figure 14 Is the electrostatic protection component of this embodiment Picture 12 Sectional view of B-B’. Figure 15 It is a schematic exploded perspective view of the electrostatic protection ...

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Abstract

The invention provides an electrostatic discharge protection component, and electronic component module using the same. An electrostatic discharge protection component comprises a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon by avoiding a part of non-forming area 18, and glass ceramic layer 14 formed thereon, a par of terminal electrodes 13 a, 13 b provided on the surface of glass ceramic layer 14 of the ceramic sintered body, a pair of external electrodes 16 a, 16 b, and heat conducting portion 15 penetrating through ceramic substrate 12 vertically, and therefore by installing and mounting a light-emitting diode on heat conducting portion 15 in non-forming area 18 of the electrostatic discharge protection component, the size can be reduced, and the heat generated by the mounted component may be released efficiently.

Description

technical field [0001] The present invention relates to a static electricity countermeasure component that is an electronic component used in various electronic equipment to protect the electronic equipment from static electricity, and an electronic component module using the static electricity countermeasure component. Background technique [0002] In recent years, the miniaturization and low power consumption of electronic devices such as mobile phones have rapidly progressed, and with this, the withstand voltage of various electronic components constituting circuits of the electronic devices has decreased. [0003] Therefore, failures of electronic equipment due to destruction of various electronic components, particularly semiconductor devices, due to electrostatic pulses generated when the human body comes into contact with the conductive portion of the electronic equipment increase. [0004] In addition, light-emitting diodes, which are one type of semiconductor device...

Claims

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Application Information

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IPC IPC(8): H01C7/10H01L33/00H01L33/62H01L33/64
CPCH01L2224/48091
Inventor 井上龙也胜村英则叶山雅昭
Owner PANASONIC CORP
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