Method for improving MOSFET anti-single particle radiation and MOSFET component
A technology for anti-single particle radiation and devices, which is applied in the manufacture of semiconductor devices, electric solid devices, semiconductor/solid devices, etc., can solve problems such as increased leakage current, not an anti-irradiation method, and weakened STI isolation ability, etc., to achieve Realize the effect of simple process and suppression of micro-dose effect
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[0026] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
[0027] figure 2 , image 3 with Figure 4 It is a structural schematic diagram of a specific embodiment of the transistor of the present invention, and the structure of the device includes: 101-gate, 102-isolation region of the device, 103-gate oxide layer, 104-P-type silicon substrate, 105-source (drain) ), 106-drain (source), 108-the angle between the sidewall of the trench in the STI region and the upper surface of the active region of the device in the optimized MOSFET structure. The channel length of the device is 130 nanometers, the thickness of the gate oxide is 3 nanometers, the depth of the isolation structure is 400 nm, and the inclination angle of the trench side wall is 85 degrees.
[0028] The following combination Figure 5 to Figure 8 And take NMOSFET as an example to briefly describe an implementation method for preparing th...
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