Method for separating fiberglass cloth and sheet metal in waste printed circuit board

Abstract

The invention belongs to the recycling of a waste printed circuit board, in particular relates to a method for separating fiberglass cloth from a metal layer (such as a copper foil, a copper wire, etc.) in the waste printed circuit board. According to different structures and requirements of the waste printed circuit board, the appropriate thermal medium is chosen; at the room temperature of 250 DEG C, the waste printed circuit board is arranged in thermal medium so that the bonding force between the glass fiber cloth and the metal layer is reduced; when bonding force disappears, according tothe differences of heat transmission coefficients between the glass fiber cloth and the metal layer, the glass fiber cloth is separated from the metal layer in the waste printed circuit board arranged in the thermal medium through mechanical or manual manners, so as to recycle the glass fiber cloth and the metal layer. The method provided by the invention can effectively separate the glass fiber cloth from the metal layer in the waste printed circuit board, the thermal medium can be recycled, and the technics is simple and pollution-free, and has commonality. The recycling of waste printed circuit board has good social and economic benefits.

Description

technical field [0001] The invention belongs to the recycling of waste printed circuit boards, in particular to a method for separating glass fiber cloth and metal layers (such as copper foil, copper wire, etc.) in waste printed circuit boards. Background technique [0002] Printed circuit boards are generally composed of glass fiber cloth base material, metal copper (such as copper foil, copper wire, etc.), printed circuit, etc., and the surface of copper foil, copper wire, etc. in the printed circuit board has a layer of polymer film material. Metal resources contained in it: copper (12.5%), nickel (1%), tin (3%), lead (5%), gold (0.025%), silver (0.1%), palladium (0.01%); non-metallic Sources: Plastic, polyester, fiberglass, etc. The gold extracted from electronic waste can be directly obtained with gold (silver) content up to the No. 2 gold (silver) standard, and the purity of gold reaches 99%. Therefore, discarded circuit boards have become the target of companies and ...

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to solve the problem of environmental pollution caused by the separation and recycling of glass fiber cloth and metal (such as copper foil, copper wire, etc.) The method of fiber cloth and metal layer (such as copper foil, copper wire, etc.)