MEMS device vacuum encapsulation method

A technology for vacuum packaging and devices, applied in instruments, microstructure devices, processing microstructure devices, etc., can solve the problems of poor electrical interconnection flexibility, difficulty in detecting vacuum degree retention ability, and difficulty in ensuring smooth implementation. cost saving effect

Inactive Publication Date: 2008-11-12
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems are: 1) the transmission of electrical signals to the outside world needs to pass through a very thick structural layer, and the corresponding through hole processing and filling are difficult, or, 2) when the electrode leads are made on the surface of the silicon wafer processed with devices , When communicating with the outside world, thick metal electrodes will make it difficult to control the bonding quality and gas leakage rate; 3) The distribution of device interconnections is mainly single-layer, and the electrical interconnection flexibility is poor; 4) When a certain micro-mechanical structure needs to be

Method used

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  • MEMS device vacuum encapsulation method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0042] Example 1

[0043] Using low-temperature co-fired ceramics as the substrate, the MEMS devices are vacuum packaged by laser sealing (see figure 2 ), the steps are:

[0044] 1. According to the needs of MEMS devices, design the interconnection lead structure and the positions of various passive components (such as capacitors, inductors, resistors, filters, balanced / unbalancers, duplexers, antenna switches, resonant cavities, etc.);

[0045] 2. Put each layer of green ceramic material in the low-temperature co-fired ceramic into a punch, and make via holes and cavities by punching;

[0046] 3. Use stainless steel as a mask on each layer of green ceramic material, and print metal as interconnect wiring and via filler by mask printing, and solder the passive components at the designated position;

[0047] 4. Multi-layer green porcelain materials are accurately laminated and aligned by positioning holes, and debinding is carried out at a temperature of about 450 ℃ in an ordinary...

Example Embodiment

[0053] Example 2

[0054] Using low-temperature co-fired ceramics as the substrate, the MEMS device is vacuum packaged by the method of welding ring sealing (see image 3 ),

[0055] The steps are:

[0056] 1. According to the needs of MEMS devices, design the interconnection lead structure and the positions of various passive components (such as capacitors, inductors, resistors, filters, balanced / unbalancers, duplexers, antenna switches, resonant cavities, etc.);

[0057] 2. Put each layer of green ceramic material in the low-temperature co-fired ceramic into a punch, and make via holes and cavities by punching;

[0058] 3. Stainless steel is used as a mask on each layer of green ceramic material, and metal is printed as interconnect wiring and via filler by mask printing, and the passive components are brazed at the designated position;

[0059] 4. Multi-layer green porcelain materials are accurately laminated and aligned by positioning holes, and the glue is discharged at a tem...

Example Embodiment

[0066] Example 3

[0067] Using low-temperature co-fired ceramics as the substrate, the MEMS device is vacuum packaged by the method of metal tube sealing (see Figure 4 ), the steps are:

[0068] 1. According to the needs of MEMS devices, design the interconnection lead structure and the positions of various passive components (such as capacitors, inductors, resistors, filters, balanced / unbalancers, duplexers, antenna switches, resonant cavities, etc.);

[0069] 2. Put each layer of green ceramic material in the low-temperature co-fired ceramic into a punch, and make via holes and cavities by punching;

[0070] 3. Stainless steel is used as a mask on each layer of green ceramic material, and metal is printed as interconnect wiring and via filler by mask printing, and the passive components are brazed at the designated position;

[0071] 4. Multi-layer green ceramic materials are accurately laminated and aligned by positioning holes, and the glue is discharged at a temperature of a...

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Abstract

The invention provides a method for vacuum packaging MEMS device by using low temperature co-fired ceramic substrate, comprising the following steps: first using the low temperature co-fired ceramic multilayer circuit structure and three-dimensional wiring to fully embed each passive component and transmission line etc. into the substrate dielectric; then bonding or welding the MEMS device onto the substrate and finishing the electrical connection; finally gaining the vacuum packaging for MEMS device by directly taking the integration of low temperature co-fired ceramic substrate with MEMS device as the base of the package, the metal package for traditional hybrid integrated circuit as the cap, and combining with traditional sealing methods, such as laser seal, land seal and metal tube seal. The technology conditions of the method has advantages of simple to realize, low in cost and easy to batch processes, and realizes vacuum seal for leads, greatly reduces leak bias rate, increases vacuum lifetime performance, particularly applicable to vacuum packaging for application of radio frequency/microwave and inert etc. oriented MEMS devices.

Description

technical field [0001] The invention belongs to the field of micro-electro-mechanical systems, and in particular relates to a method for vacuum packaging MEMS devices such as radio frequency, microwave and wireless communication. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) technology is a multidisciplinary emerging technology field developed on the basis of microelectronics technology, involving conventional integrated circuit design / process technology and micro-mechanical expertise as well as physics, biochemistry, automatic control, integrated circuits Its research object is a micro-device or system that integrates micro-mechanisms, micro-sensors, micro-actuators, and signal processing / control circuits, interfaces, communications, and power supplies. MEMS devices are low-cost, full-featured, small in size, light in weight, mechanically flexible, low in power consumption, high in reliability, and excellent in performance. They have been widely used...

Claims

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Application Information

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IPC IPC(8): B81C3/00
Inventor 金玉丰张杨飞缪旻白树林
Owner PEKING UNIV
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