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Surface treating method of radio frequency passive module

A surface treatment, radio frequency technology, applied in the field of surface treatment of radio frequency passive modules, can solve the problems of troublesome protection, easy oxidation, shortened product life cycle, etc.

Active Publication Date: 2008-11-26
SHENZHEN GRENTECH RF COMM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since silver is a precious metal, and the silver layer is easily oxidized on the surface of the module, although the electrical performance of the module after silver plating has been improved, its defects are also obvious
The silver-plated module is not only costly, but also the silver-plated layer is prone to oxidation to form silver oxide or silver sulfide, causing the surface to turn yellow or black, and the storage time will be very short under natural conditions (usually only 3 to 6 months), the protection of products containing silver-plated RF passive modules in the production process is also quite troublesome, and the life cycle of the product will also be shortened due to the oxidation of the silver-plated layer

Method used

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  • Surface treating method of radio frequency passive module
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  • Surface treating method of radio frequency passive module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Take the RF passive module to be processed, and after the surface treatment, place the Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions to precipitate a copper-tin-zinc ternary alloy:

[0043] In each liter of electroplating solution: 100g of copper sulfate (40%)

[0044] Potassium stannate (40%) 115g

[0045] Zinc cyanide (1%) 90g

[0046] Sodium cyanide 30g

[0047] Current density: 0.5-2.5A / dm 2

[0048] Temperature: 50-60℃

[0049] pH value: 10-11

[0050] The plating rate is 0.1μ / A·min;

[0051] After the electroplating is completed, a copper-tin-zinc ternary alloy layer with a thickness of about 0.1μ is obtained on the surface of the radio frequency passive module, and then the module is washed, organically protected, hot water treated, dried, and packaged.

Embodiment 2

[0053]Take the RF passive module to be processed, clean the surface, remove dust, degrease and remove oil, and wash with water; then perform acid activation, primary zinc immersion, dezincification, and secondary zinc immersion treatments, and wash with water; at the same time, the pretreated RF The surface of the passive module is first plated with a dense and uniform layer of active copper (4-8μ) to improve the bonding force between the final electroplated copper-tin-zinc ternary alloy layer and the surface of the module, and to improve the conductivity and magnetic permeability of the product Rate; and washed with water; then, put the copper-plated RF passive module into the Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions to precipitate a copper-tin-zinc ternary alloy:

[0054] Per liter of electroplating solution: 125g copper sulfate (40%)

[0055] Potassium stannate (40%) 139g

[0056] ...

Embodiment 3

[0064] Take the RF passive module to be processed, clean the surface, remove dust, degrease and remove oil, and wash with water; then perform acid activation, primary zinc immersion, dezincification, and secondary zinc immersion treatments, and wash with water; at the same time, the pretreated RF The surface of the passive module is first plated with a dense and uniform layer of active copper (4-8μ) to improve the bonding force between the final electroplated copper-tin-zinc ternary alloy layer and the surface of the module, and to improve the conductivity and magnetic permeability of the product Rate; and washed with water; then, put the copper-plated RF passive module into the Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions to precipitate a copper-tin-zinc ternary alloy:

[0065] Per liter of electroplating solution: copper sulfate (50%) 90g

[0066] Sodium stannate (40%) 112g

[0067] ...

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Abstract

The invention relates to a surface processing method for a radio frequency passive module, which is to electroplate a ternary alloy layer of copper, tin and zinc on the surface of the module and comprises the steps of pretreatment, preprocessing, pre copper plating, electroplating ternary alloy of copper, tin and zinc and post treatment. The invention adopts the surface processing method of electroplating the ternary alloy of copper, tin and zinc on the surface of the radio frequency passive module, which replaces the traditional silver plating technique. The radio frequency passive module after surface treatment fully satisfies electrical performance of the radio frequency passive module and at the same time reduces cost. Furthermore, the temperature resistance performance and the anti-corrosion performance are greatly improved, thus the service life of the related communication product is prolonged. Compared with the traditional silver plating technique, the steps of electroplating ternary alloy of copper, tin and zinc and post treatment simplify the processing steps, relatively save the electroplating time and also improve the working efficiency.

Description

【Technical Field】 [0001] The invention relates to the field of surface treatment of communication materials, in particular to a surface treatment method for radio frequency passive modules. 【Background technique】 [0002] RF passive modules (such as duplexers, filters, combiners, splitters, couplers, power splitters, etc., usually made of aluminum) in order to achieve good electrical performance (standing wave, intermodulation, loss , Attenuation, etc.), silver plating is generally used on the surface of the module to improve the electrical performance of the product. Silver electroplating is an indispensable process in the processing of passive modules. After the silver plating is completed, the surface of the module appears bright silver or sub-silver, and a layer of Ni(1~2μ)-Cu(1~5μ)-Ag is usually formed on the surface of the module. (1~7μ) or Cu(1~5μ)-Ag(1~7μ) plating. Since silver is a precious metal, and the silver layer is easily oxidized on the surface of the module, alth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D3/60C25D5/34
Inventor 王丛
Owner SHENZHEN GRENTECH RF COMM LTD
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