Surface treating method of radio frequency passive module
A surface treatment and radio frequency technology, applied in the field of surface treatment of radio frequency passive modules, can solve the problems of blackening, yellowing of the surface, shortening of product life cycle, etc.
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Embodiment 1
[0042] Take the RF passive module to be processed, after surface treatment, insert Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions, and the copper-tin-zinc ternary alloy is precipitated:
[0043] In each liter of electroplating solution: copper sulfate (40%) 100g
[0044] Potassium stannate (40%) 115g
[0045] Zinc cyanide (1%) 90g
[0046] Sodium cyanide 30g
[0047] Current density: 0.5-2.5A / dm 2
[0048] Temperature: 50-60°C
[0049] pH: 10-11
[0050] The plating rate is 0.1μ / A min;
[0051] After the electroplating is completed, a copper-tin-zinc ternary alloy layer with a thickness of about 0.1μ is obtained on the surface of the RF passive module, and then the module is washed with water, organically protected, treated with hot water, dried, and packaged.
Embodiment 2
[0053] Take the RF passive module to be treated, clean and dust the surface, degrease and degrease, and wash with water; then carry out acid activation, primary zinc dipping, zinc stripping, secondary zinc dipping treatment, and water washing; at the same time, the pretreated RF The surface of the passive module is first plated with a layer of dense and uniform active copper (4-8μ) to improve the bonding force between the final electroplated copper-tin-zinc ternary alloy layer and the surface layer of the module, and to improve the electrical conductivity and magnetic permeability of the product rate; and washed with water; then, put the copper-plated RF passive module into the Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions, and the copper-tin-zinc ternary alloy is precipitated:
[0054] In each liter of electroplating solution: copper sulfate (40%) 125g
[0055] Potassium stannate (40%) 139g ...
Embodiment 3
[0064] Take the RF passive module to be treated, clean and dust the surface, degrease and degrease, and wash with water; then carry out acid activation, primary zinc dipping, zinc stripping, secondary zinc dipping treatment, and water washing; at the same time, the pretreated RF The surface of the passive module is first plated with a layer of dense and uniform active copper (4-8μ) to improve the bonding force between the final electroplated copper-tin-zinc ternary alloy layer and the surface layer of the module, and to improve the electrical conductivity and magnetic permeability of the product rate; and washed with water; then, put the copper-plated RF passive module into the Cu-containing 2+ , Sn 4+ , Zn 2+ The electroplating solution is electroplated under the following process conditions, and the copper-tin-zinc ternary alloy is precipitated:
[0065] In each liter of electroplating solution: copper sulfate (50%) 90g
[0066] Sodium stannate (40%) 112g
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