Light-high-strength epoxy foam material and preparation method thereof
A foaming material and high-strength technology, applied in the field of foaming materials, can solve the problems of high cost and difficult to control the chemical reaction of epoxy foams, and achieve the effect of smooth surface and dense internal cell structure.
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Embodiment 1
[0048] A kind of preparation method of light weight high-strength epoxy foaming material: 188 grams of bisphenol A epoxy resin, aromatic amine DDM35 grams, low molecular weight polyamide (650 type) 12 grams, nitrile rubber 9.7 grams, surface active Add 0.4 grams of alkylphenol polyethylene glycol ether OP and 16 grams of domestic ceramic powder into the reactor and place in a 50°C water bath to preheat and stir evenly. After 40 minutes, the temperature of the material reaches about 49°C. At this time, add the pre-weighed 1 g of good foaming agent diazoaminobenzene, continue to stir and react for 20 minutes, inject the material into a mold preheated to 51°C, and transfer it to an oven, keep the oven temperature at 60°C, after 3 hours, lift the oven Temperature to 120°C, keep warm for 6 hours and then cool to room temperature with the furnace to demould.
Embodiment 2
[0050] A kind of preparation method of light-weight high-strength epoxy foam material: 150 grams of polyether epoxy resin, aromatic amine DDM 29.4 grams, low molecular weight polyamide (650 type) 9.5 grams, nitrile rubber 8.3 grams, surface active Add 0.4 g of agent OP and 12.3 g of hollow ceramic microspheres into the reactor and place in a 50°C water bath to preheat and stir evenly. After 40 minutes, the temperature of the material reaches 48°C. 6 grams of hydrazine, continue to stir and react for 20 minutes, the temperature of the material rises to 50°C, inject the material into a mold preheated to 50°C, and transfer it to the oven, use "PID" to control the temperature increase in stages, after heat preservation (130°C) Cool to room temperature with the furnace and release the mold.
Embodiment 3
[0052]A preparation method of light-weight high-strength epoxy foaming material: 60 grams of bisphenol A epoxy resin, 60 grams of novolak epoxy resin, 33 grams of aromatic amine DDM, 2.4 grams of ethylenediamine, and dioxydioxide Add 18 grams of amyl ether and 3.6 grams of surfactant OP into the reactor and place it in a 50°C water bath to preheat and stir evenly. After 20 minutes, the temperature of the material reaches 45°C. At this time, add the pre-weighed foaming agent Sulfonylhydrazide diphenyl ether 6 grams, continue to stir and react for 20 minutes, the temperature of the material rises to about 47°C, inject the material into a mold preheated to 56°C, and transfer it to the oven, use "PID" to control the temperature rise in stages, Keep warm (140°C) and then cool down to room temperature with the furnace to demould.
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