Semiconductor test management system

Abstract

The invention relates to a semiconductor test management system, comprising a circuit probe detection map recording the electricity property of a wafer; an automatic defect detection device detecting the defects of the wafer and a computer storing selection software, wherein the selection software contains selection standards for selecting the defects of the wafer. The semiconductor test management can detect the defects of wafers, simplifies test program and adopts computer to improve test efficiency.

Description

technical field [0001] The invention relates to a semiconductor test management system, in particular to a semiconductor test management system used for wafer circuit needle testing and defect detection. Background technique [0002] In the semiconductor manufacturing process, semiconductor wafers usually go through a series of processes, such as exposure, chemical mechanical polishing, chemical vapor deposition, etching, wafer testing, dicing, packaging, and the like. For example, a 15-micron semiconductor product may go through nearly 600 processing steps, among which wafer testing is an important and indispensable part of the semiconductor industry chain, which runs from the beginning of product design to the completion of processing the whole process. [0003] General wafer testing includes circuit probe (CP) and defect detection. The circuit needle test is to detect the electrical characteristics of each die on the wafer 1, so as to detect and eliminate unqualified di...

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Problems solved by technology

[0004] However, from the above-mentioned wafer testing process, we can find that the above-mentioned testing process has many steps, the procedure is complicated, and there are many manual operations, which are prone to errors and low testing efficiency.

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