Low temperature resistant polyamide thermosol adhesive and use thereof

A polyamide hot-melt adhesive and adhesive technology, which is applied in the direction of adhesives, etc., can solve the problems of low elongation and low temperature resistance of polyamide hot-melt adhesives.

Active Publication Date: 2009-02-25
SHANGHAI LIGHT IND RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyamide hot melt adhesives have the disadvantages of low temperature resistance and low elongation, and it is difficult to meet some special requirements in the automotive industry

Method used

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  • Low temperature resistant polyamide thermosol adhesive and use thereof
  • Low temperature resistant polyamide thermosol adhesive and use thereof
  • Low temperature resistant polyamide thermosol adhesive and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0035] The following examples are used to further illustrate the present invention, but it should be understood that these examples cannot be used to limit the protection scope of the present invention.

[0036] In the following examples, the performance parameters of the polyamide hot-melt adhesive of the present invention were determined as follows.

[0037] Softening point test:

[0038] On the SYP4202-I asphalt softening point tester, the test is carried out with reference to the standard GB / T15332-94.

[0039] Melt viscosity test:

[0040] The melt viscosity of the sample was tested with a Brookfield DV-E rotary viscometer, and 11.0 g of polyamide hot melt adhesive samples were weighed. During the test, the rotor of the model S27 was selected, the temperature was controlled at 160 ° C, and the rotational speed was constantly adjusted to make it The test value is within the linear range of 10% to 90%, and the measured value is recorded after stabilization.

[0041] Dete...

Embodiment 1

[0069] Add 334.8 grams of dimerized linoleic acid (purchased from Shanghai Huasheng Chemical Co., Ltd., brand GX92) into a 1000ml reaction bottle with a thermometer, a mechanical stirrer, a condenser tube and a nitrogen inlet tube, and in a 100ml constant pressure dropper Load 21.6g of ethylenediamine and 54.7g of polyetheramine D-230, blow in nitrogen, stir, and heat up. When the temperature in the reaction bottle reaches 130°C, add the mixed amine dropwise. The temperature is controlled at 130-140°C. After the addition, start to slowly heat up to about 230°C. During the heating process, water will distill out. When the reaction temperature reaches 230-240°C, use a vacuum pump to decompress and vacuumize. The vacuum degree is <100Pa. When the stirring power reaches a certain value, After the reaction was completed, the vacuum was removed, and the melt was poured on a tetrafluoro plate to obtain a yellow rubber strip (sample 8 in Table 1).

[0070] After drying at 50°C for 24 ...

Embodiment 2-11

[0072] Prepare in the same manner as Example 1, except that different polyetheramines are used in the system, such as D-400 and D-2000, and different ethylenediamine and polyetheramine ratios (sample in table 1 9-18).

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Abstract

The present invention provides a low-temperature polyamide hot-melt adhesive. The present invention contains unsaturated aliphatic dimer acid polymeric unit and polyamine polymeric unit; wherein, the polyamine polymeric unit contains 50 to 90 mol percent of C2-8 aliphatic diamine polymeric unit and 5 to 50 mol percent of polyether polyamine polymeric unit; the total mol number of polyamine polymeric unit is taken as the benchmark. The polyamide hot-melt adhesive provided by the present invention has excellent low temperature resistance and extensibility, and is especially suitable for automobile industry.

Description

technical field [0001] The invention relates to a polyamide hot-melt adhesive and an application thereof, more particularly to a low-temperature resistant polyamide hot-melt adhesive and an application thereof. Background technique [0002] The outstanding advantages of polyamide hot melt adhesives are low melting temperature, narrow melting point range, strong polarity, high bonding strength, good processing performance, good wear resistance and good flexibility, and are often used in automobiles, electronics, printing There are a wide range of applications in industries such as packaging and shoes and hats. [0003] However, polyamide hot-melt adhesives have the disadvantages of low temperature resistance and low elongation, which make it difficult to meet some special requirements in the automotive industry. Contents of the invention [0004] The object of the present invention is to provide a polyamide hot-melt adhesive with significantly improved low temperature resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06
Inventor 顾庆锋孙静蔡真
Owner SHANGHAI LIGHT IND RES INST
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