Grinding processing method and grinding processing device

A grinding process and grinding technology, which is applied in the direction of spraying devices, explosion generating devices, metal processing equipment, etc., can solve problems such as uneven processing, achieve the effect of reducing the amount of grinding and increasing the number of regenerations

Inactive Publication Date: 2012-07-25
FUJI MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] In addition, it is not limited to the case of silicon wafers as the processing object, even if it is grinding of evaporation jigs or mold cleaning, and grinding processing of any other workpiece, the workpiece moving on the rotation path is processed. In any case, there may be uneven processing as mentioned above

Method used

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  • Grinding processing method and grinding processing device
  • Grinding processing method and grinding processing device
  • Grinding processing method and grinding processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0197] (embodiment 1; processing method: Figure 15 (A))

[0198]

[0199] The film formed on the surface of the test wafer was removed, and a uniform smooth mirror surface without processing unevenness was formed on the wafer surface, and mirror polishing by a polishing device was not required. Therefore, the time required for wafer polishing can be greatly shortened, and a polishing apparatus is not required. Furthermore, since the film formed on the wafer can be efficiently removed, the wafer can be regenerated.

[0200] 【table 3】

Embodiment 2

[0201] (embodiment 2; processing method: Figure 15 (B))

[0202]

[0203] (embodiment 2; processing method: Figure 15 (B))

[0204]

[0205] The following devices are connected to the spray processing device 1 constituted as described above: an unshown compressed air supply source such as an air compressor; Produced dust etc. are sucked; And cyclone separator 60, it is used for reclaiming the ground material after removing dust from the grinding material mixed with dust that is sucked from processing chamber 3 by this dust collector 50, constructs Such as Figure 14 A processing system for spray processing a wafer W is shown.

[0206] Furthermore, while opening the opening and closing door on the casing 2 of the spray processing apparatus 1, the wafer W is mounted on the chuck 12 arranged on the turntable 11 in the casing 2, and the spray processing apparatus 1 is started, then Utilize the nozzle 20 installed on the rocker arm 31 (31a, 31b, 31c) to spray the abrasiv...

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PUM

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Abstract

The invention provides a ground finish method and a ground finish device for evenly spaying an abrasive substance on a finished surface of a work piece (W) moving on a rotary track. When the work piece is rotated on the predetermined rotary track, the moving speed of a nozzle (20) for spraying quantitative abrasive substance each time is controlled, and the nozzle (20) is moved repeatedly to and fro between a peripheral line and an inner circumference line of the rotary track or among the peripheral line, the central direction and the peripheral line; and the moving speed of the nozzle (20) is controlled as relative quick along with the moving speed towards the central side of the rotary track and relative slow along with the moving speed towards the peripheral side. The control for the moving speed of the nozzle (20) divides the rotary track of the work piece (W) into a plurality equal areas in a concentric circle shape, so that the nozzle (20) passes across each equal area respectively in constant time.

Description

technical field [0001] The present invention relates to various grinding materials such as spraying abrasive grains, sand blasting materials, and abrasive materials (in the present invention, these are collectively referred to as "abrasive materials."), to the processed object and even the processed object surface (in the present invention In, referred to as "workpiece (W)".) Grinding, cutting, blasting, cleaning, etc. (in the present invention, these are collectively referred to as "grinding", and the methods used in them are called grinding methods, The device used will be referred to as a grinding device.) A grinding method and a grinding device, for example, relate to wafers such as silicon wafers (hereinafter, simply referred to as "workpiece (W) ".) as processing objects , A grinding method for grinding a film or dirt formed on the wafer, and a grinding apparatus using the grinding method. Background technique [0002] For example, a semiconductor device material such...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24C3/12B24C5/00
CPCB05B3/02B24C3/12B24C5/04
Inventor 间瀬惠二月田盛夫
Owner FUJI MFG CO LTD
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