Thin-film solar cell module and processing method thereof

Abstract

The invention discloses a thin-film solar cell module and a processing method thereof. Firstly, a backlight conductive film, an electric layer and a phototropic conductive film are plated on a substrate in sequence, and then marking and cutting are carried out to cause the phototropic conductive film, the electric layer and the backlight conductive film to be cut off to form a fourth tangent groove; the phototropic conductive film and the electric layer are cut off to form a fifth tangent groove; the phototropic conductive film and the electric layer are cut off to form a sixth tangent groove; an electric conductor is filled between the detached surfaces of the phototropic conductive film in the fourth tangent groove, insulators are filled in the detached surfaces of the electric layer and the backlight conductive film, and electric conductors are filled in the fifth tangent groove. Marking operation is carried out after coating is finished completely, therefore, the process time is reduced, the process steps are greatly simplified, and the pollution to the battery due to a plurality of times of marking and cleaning is reduced.

Description

technical field [0001] The invention relates to a thin-film solar battery module and a processing method thereof. Background technique [0002] Thin-film solar cells have become the most promising new type of solar cells due to the characteristics of low material consumption, low cost and wide application, and have become a key project and hot topic in the research and development of photovoltaic technology in the world today. Its types include silicon-based thin-film solar cells, CdTe cadmium telluride-based thin-film solar cells, and CIS copper-indium-selenium-based thin-film solar cells. Although these different types of thin-film solar cells have different structures, they can generally be summarized as : a structure in which a substrate, a conductive layer, a power generation layer and a conductive layer are distributed sequentially, wherein the power generation layer includes a buffer layer 4 and a semiconductor absorption layer 5 . [0003] When modularizing thin-fil...

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Problems solved by technology

[0006] This kind of scribing method has complicated process steps, and the substrate needs to be taken out from the vacuum state for scribing after each film coating, and three-step scribing is required, which prolongs the process time; at the same time, this method requires the use of laser and The mechanical scribing machine requires extremely high scribing accuracy, the equipment is expensive, and it is very difficult to scribing on flexible materials; When the film is used, the thickness of the film is required to be thicker, resulting in a greater loss of incident light intensity

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