Laminating apparatus, and laminating method using it

A technology for lamination devices and laminates, applied in lamination devices, laminations, lamination systems, etc., can solve the problem of residual air bubbles, lamination materials 95 clinging and following, film materials clinging and following circuit boards 82 and other problems, to achieve the effect of excellent adhesion, improved adhesion followability, and excellent heat resistance

Active Publication Date: 2009-03-11
NIKKO MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the membrane-type vacuum laminator, since the thickness of the membranes 79 and 81 is relatively thick (about 2 to 3 mm), the spacing between the unevenness on the circuit board 82 is fine (about 20 μm) or the unevenness is deep (about 40 μm). In the case of the above), it is difficult to make the film-like material closely adhere to and follow the circuit board 82, and air bubbles will remain between the circuit board 82 and the film-like material.
On the other hand, the non-membrane type vacuum laminator is more efficient than the diaphragm type vacuum laminator in that it can easily pressurize from

Method used

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  • Laminating apparatus, and laminating method using it
  • Laminating apparatus, and laminating method using it
  • Laminating apparatus, and laminating method using it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] The vacuum laminator 2 and the flat presser 3 shown in FIG. 1 were used. The space part 34 was previously adjusted to 110 degreeC by the hot plate 23,26 of the upper and lower plates 20,21 of the vacuum laminator 2. First, a film-shaped resin material 8b composed of a thermosetting resin composition (glass transition temperature: 80°C) and a polyethylene terephthalate support film is placed on both front and back surfaces of a substrate 8a having concavo-convex surfaces. , the thermosetting resin composition is made of epoxy resin, and the resin surface of the two film-like resin materials 8b (the thickness of the resin layer is 38 μm) and the uneven surface of the above-mentioned substrate 8a (the thickness of the uneven 18 μm, and the interval of unevenness is 20 μm) and temporarily fixed by contacting, and the temporary laminated body 7 was prepared.

[0131] Next, the above-mentioned temporary laminated body 7 is transported into the vacuum lamination device 2 by u...

Embodiment 2

[0154] Under the conditions of Example 1, the substrate 8a was placed in the central part of the hot plates 23, 26 of the vacuum laminator 2, and after running 300,000 times, the laminated body 9 obtained under the conditions of Example 1 was similarly Followability, film thickness uniformity, surface specularity, and generation of wrinkles were evaluated.

Embodiment 3

[0156] Under the conditions of Example 2, except for the upper and lower elastic pressure plates 24 and 27 of the vacuum laminator 2, a fluorine-containing silicone with a Shore A hardness of 60 degrees, a thickness of 4 mm, and a surface roughness Rz of 3 μm The rubber is vulcanized and bonded to one side of a stainless steel plate (SUS630H, thickness 2 mm) with a flatness of 3 μm, and the surface of the unvulcanized side of the fluorine-containing silicone rubber is bonded, and "KINYO BOARDF200" manufactured by Jinyang Company is used as a cushioning material (dimensions (vertical x horizontal) 63 cm x 63 cm) were fixed outside the upper and lower hot plates 23 and 26, and the laminated body 9 was formed under the same conditions, and the followability, film thickness uniformity, surface specularity, and wrinkle were similarly evaluated. produce.

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Abstract

The apparatus is equipped with vacuum laminating unit (2) furnished with a pair of heat discs (23,26) opposed to each other, at least one of these heat discs (23,26) capable of advancing forward and backward relative to the other. There is provided a laminating apparatus adapted to superimpose a film resin material on base material (8a) having at least one of its front and back surfaces furnished with unevenness on the uneven surface by the use of the vacuum laminating unit(2) to thereby form laminate (9), wherein elastic press plate (24(27)) brought into contact with the surface of the film resin material (8b) and pressing the same is disposed on the side of film resin material of the heat disc (23(26)) opposed to the film resin material. Accordingly, even when the unevenness interspace of the base material (8a) is minute, close follow of film resin layer on the base material (8a) can be attained so as to avoid any remaining of bubbles between the base material (8a) and the film resin layer.

Description

technical field [0001] The present invention relates to a lamination device used in the manufacture of printed circuit substrates and the like and a lamination method using the lamination device. A lamination apparatus that can be used in a build-up process method that has a substrate having unevenness, such as a substrate, without air bubbles remaining between the substrate and a film-like resin layer, and a lamination method using the lamination apparatus. Background technique [0002] In recent years, with the miniaturization and high performance of electronic equipment, the density and multilayering of printed circuit substrates have continued to develop. As special applications such as MPU packaging circuit boards, the thickness of the circuit substrate is relatively thick. Also increasing. For the multilayering of such a printed circuit base material, a thermosetting resin composition or a photosensitive resin composition is used as an electrical insulating layer, and...

Claims

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Application Information

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IPC IPC(8): B29C65/02B29C43/32B30B15/34B32B37/20B29L9/00
CPCB29C2043/561B32B37/223B29C63/0047B32B2457/08B29C43/203B32B39/00B29C43/184B32B37/003H05K3/281B32B2309/68B29C2043/3652B29C43/36B30B15/06H05K3/46
Inventor 安本良一岩田和敏
Owner NIKKO MATERIALS CO LTD
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