Laminating apparatus, and laminating method using it

Abstract

The apparatus is equipped with vacuum laminating unit (2) furnished with a pair of heat discs (23,26) opposed to each other, at least one of these heat discs (23,26) capable of advancing forward and backward relative to the other. There is provided a laminating apparatus adapted to superimpose a film resin material on base material (8a) having at least one of its front and back surfaces furnished with unevenness on the uneven surface by the use of the vacuum laminating unit(2) to thereby form laminate (9), wherein elastic press plate (24(27)) brought into contact with the surface of the film resin material (8b) and pressing the same is disposed on the side of film resin material of the heat disc (23(26)) opposed to the film resin material. Accordingly, even when the unevenness interspace of the base material (8a) is minute, close follow of film resin layer on the base material (8a) can be attained so as to avoid any remaining of bubbles between the base material (8a) and the film resin layer.

Description

technical field [0001] The present invention relates to a lamination device used in the manufacture of printed circuit substrates and the like and a lamination method using the lamination device. A lamination apparatus that can be used in a build-up process method that has a substrate having unevenness, such as a substrate, without air bubbles remaining between the substrate and a film-like resin layer, and a lamination method using the lamination apparatus. Background technique [0002] In recent years, with the miniaturization and high performance of electronic equipment, the density and multilayering of printed circuit substrates have continued to develop. As special applications such as MPU packaging circuit boards, the thickness of the circuit substrate is relatively thick. Also increasing. For the multilayering of such a printed circuit base material, a thermosetting resin composition or a photosensitive resin composition is used as an electrical insulating layer, and...

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Problems solved by technology

[0009] However, in the membrane-type vacuum laminator, since the thickness of the membranes 79 and 81 is relatively thick (about 2 to 3 mm), the spacing between the unevenness on the circuit board 82 is fine (about 20 μm) or the unevenness is deep (about 40 μm). In the case of the above), it is difficult to make the film-like material closely adhere to and follow the circuit board 82, and air bubbles will remain between the circuit board 82 and the film-like material.

On the other hand, the non-membrane type vacuum laminator is more efficient than the diaphragm type vacuum laminator in that it can easily pressurize from a thinner substrate to a thicker substrate with a strong pressure. It is advantageous, but as the above-mentioned lamination forming apparatus utilizes a pair of hot discs 93a, 93b, a mirror plate to press the lamination material 95, and the laminated material 96, it is the same as the membrane type vacuum lamination apparatus. When the interval between the irregularities of the laminated material 96 is fine (about 20 μm) or the irregularities are deep (more than 40 μm), it is difficult to make the laminated material 95 closely adhere to and follow the laminated material 96. Bubbles trapped between 96 and laminate 95

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