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Process for producing phenolic resin and process for producing epoxy resin

一种制造方法、酚树脂的技术，应用在环氧树脂的制造领域，能够解决无法得到固化物、固化时间慢等问题

Active Publication Date: 2009-03-11
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, although the modified polyarylene ether obtained by reducing the molecular weight of the polyarylene ether can achieve a certain degree of molecular weight reduction, and can be used as a varnish composition using a solvent in combination, it is especially difficult for electronic components. When melt-molding packaging materials, etc., since they do not flow at molding temperatures (specifically, 150 to 200°C), the current situation is that the curing time is extremely slow, and practical cured products cannot be obtained.

Method used

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  • Process for producing phenolic resin and process for producing epoxy resin
  • Process for producing phenolic resin and process for producing epoxy resin
  • Process for producing phenolic resin and process for producing epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0173] Example 1 [Synthesis of Phenol Resin (a-1)]

[0174] In the flask that thermometer, dropping funnel, cooling tube, fractionating tube, stirrer are installed, 2,7-dihydroxynaphthalene represented by 160g (1.0mol) of the following formula is charged,

[0175] [chemical 17]

[0176]

[0177] While blowing in nitrogen gas and stirring, it was heated to 200° C. and melted. After melting, 23 g (0.2 mol) of 48% potassium hydroxide aqueous solution were added. Then, water derived from a 48% potassium hydroxide aqueous solution and generated water were extracted using a fractionating tube, and then reacted for another 5 hours. After the reaction was finished, 1000 g of methyl isobutyl ketone was added, and after dissolving, it was transferred to a separatory funnel. Next, after washing with water until the washing water becomes neutral, the solvent was removed from the organic layer under reduced pressure under heating to obtain 150 g of phenol resin (1). The obtained pheno...

Embodiment 2

[0195] Embodiment 2 [synthesis of phenol resin (a-2)]

[0196] Except changing 160g of 2,7-dihydroxynaphthalene in Example 1 to 160g of 1,6-dihydroxynaphthalene, it carried out similarly to Example 1, and obtained 147g of phenol resin (a-2). The obtained phenol resin (a-2) was a brown solid with a hydroxyl equivalent of 135 g / eq and a melting point of 137°C. From the GPC chart of FIG. 5 , it was confirmed that the remaining rate of the unreacted raw material (1,6-dihydroxynaphthalene) was 24% by area ratio as measured by GPC.

Embodiment 3

[0197] Embodiment 3 [synthesis of phenol resin (a-3)]

[0198] Except changing 160g 2,7-dihydroxynaphthalene in embodiment 1 to 80g (0.5mol) 2,7-dihydroxynaphthalene and 55g (0.5mol) 1,3-dihydroxybenzene, same as embodiment 1 This was carried out to obtain 125 g of phenol resin (a-3). The obtained phenol resin (a-3) was a brown solid with a hydroxyl equivalent of 101 g / eq and a melting point of 136°C. From the GPC chart of FIG. 6 , it was confirmed that the remaining ratio of unreacted raw materials (total of 2,7-dihydroxynaphthalene and 1,3-dihydroxybenzene) was 36% by area ratio as measured by GPC.

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Abstract

A process for producing a phenolic resin in which a plyarylene ether having a low melt viscosity can be industrially produced by an extremely simple method without the need of a special post-treatment after polymerization or a complicated multistage reaction; and a process for producing an epoxy resin from a phenolic resin obtained by that process. The process for producing a phenolic resin having a polyarylene ether structure is characterized by subjecting a polyhydric aromatic compound (A) having two or more phenolic hydroxy groups per molecule to dehydrating condensation in the presence of a basic catalyst (B).

Description

technical field [0001] The present invention relates to a method for producing a phenol resin having a polyarylene ether structure by a simple method, and a method for producing an epoxy resin using the phenol resin as a raw material. Background technique [0002] Epoxy resins and phenolic resins are widely used in the electronic field because they provide cured products with low shrinkage during curing, dimensional stability of cured products, electrical insulation, and chemical resistance. However, in recent years, in the electronic field such as semiconductor packaging materials, due to the surface mounting of semiconductors for the purpose of high density of electronic components, the miniaturization of semiconductors themselves, or the conversion to lead-free solders, Therefore, for electronic component materials, higher thermal shock resistance is required, and thus materials with low melt viscosity that can be highly filled with fillers are required. [0003] As a lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/38C08G59/24
CPCC08G59/3218C08G59/245C08L63/00C08G59/24C08G59/62
Inventor 有田和郎小椋一郎森永邦裕
Owner DIC CORP
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