Photo-setting adhesive

An adhesive, light-curing technology, applied in the direction of adhesives, adhesive types, non-polymer organic compound adhesives, etc., can solve the problems of accelerated oxidation cracking of compounds, inability to ensure high bonding strength, and attenuation of bonding strength. , to achieve the effect of excellent adhesive ability, high adhesive strength and improved adhesiveness

Inactive Publication Date: 2009-03-25
GUANGDONG HENGDA NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These accelerators are usually phosphate esters with high polarity, which shows that the initial bonding strength is particularly high, but excessive polar groups enhance the water absorption rate, resulting in a large attenuation of the long-term bonding effect, which cannot guarantee long-lasting high viscosity. Contact strength
[0007] High temperature has a great impact on li

Method used

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  • Photo-setting adhesive
  • Photo-setting adhesive

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] 1. Take 30g polyether-based urethane acrylate (produced by Guangdong Hengda New Material Technology Co., Ltd., code PR5002), 20g polybutadiene acrylate (Japan Soda Co., Ltd., TE-2000), 10g epoxy acrylate ( Sartomer, US Sartomer, CN151), 18g SR531 (Sartomer), 15g hydroxypropyl methacrylate HPMA, 3g acrylic acid AA, 4g photoinitiator I-184 (Ciba Refining), stir and mix uniformly.

Example Embodiment

[0028] Example 2

[0029] 40g polyether-based urethane acrylate (produced by Guangdong Hengda New Material Technology Co., Ltd., number PR5002), 20g polyester-based urethane acrylate (Sartomer, CN981), 18gSR531 (Sartomer), 15g hydroxypropyl methacrylate HPMA, 3g acrylic AA, 4g photoinitiator I-184 (Ciba Refining), stir and mix to obtain.

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PUM

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Abstract

The invention discloses a photo-curing adhesive, in particular relates to an adhesive of ultraviolet rays or visible light. The adhesive comprises components of the following weight ratios: 10 percent to 75 percent of matrix resin, 5 percent to 50 percent of assisted resin and 10 percent to 70 percent of acrylate monomer, wherein, the matrix resin is a mixture of one or the mixture of polyether-based polyurethane and polybutadiene acrylate and the assisted resin is one or the mixture of polyurethane acrylate or epoxy acrylate. The photo-curing adhesive provided by the invention has better adhesive performance than a common adhesive, especially has very high adhesive strength to glass, crystal and metal, meanwhile, the photo-curing adhesive has excellent resistance performance to high temperature, high humidity and water boiling, thereby having wide application prospect.

Description

technical field [0001] The invention relates to a photocurable adhesive, in particular to an ultraviolet or visible light curable adhesive. Background technique [0002] The light-curing adhesive in the prior art is easy to use, solidifies quickly, and can bond transparent materials (at least one side of the adherend is light-transmitting), and is widely used in the bonding of glass and crystal, and the bonding of glass and metal. , such as glass and metal furniture products, but these glass and glass and metal products often encounter high-temperature and high-humidity storage and transportation environments. As a result, the bonding failure of the light-curing adhesive is found. When it is transported to the destination, it is found that the bonding is damaged. It usually shows that the apparent interface of the bonding is damaged, the adhesive film falls off, and the interface of the bonding glass is damaged, and the glue remains on the metal. This is The bonding failure...

Claims

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Application Information

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IPC IPC(8): C09J4/06C09J175/14
Inventor 关怀刘秀棉陈三多龙正宇周为民
Owner GUANGDONG HENGDA NEW MATERIALS TECH
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