Crystal particle reconfigure encapsulation method

Abstract

An encapsulation method of reconfiguration of crystal grains comprises: a plurality of crystal grains are provided, and each of the crystal grains is provided with an active surface which is configured with a plurality of pads; the crystal grains are attached to a base plate, and each of the crystal grains connects the active surface and an adhesive layer configured on the base plate in a way of flip chip; polymer material is formed on the base plate and part of the crystal grains; and then, the polymer material is covered with the a die device in order to lead the polymer material to be flat, so that the polymer material is filled among the crystal grains and covers the crystal grains; after that, the polymer material is separated from the die device to lead the surface of the polymer material to be exposed; a plurality of scribe lines are formed on the exposed polymer material; at last, the polymer material is separated from the base plate to expose the active surface of each crystal grain, so that an encapsulation body is formed.

Description

technical field [0001] The invention relates to a packaging method for semiconductors, in particular to a packaging method for crystal grain reconfiguration. Background technique [0002] Semiconductor technology has developed quite rapidly, so the miniaturized semiconductor die (Dice) must have diversified functional requirements, so that the semiconductor die must be configured with more input / output pads (I / O pads) in a small area. O pads), so that the density of metal pins (pins) is also rapidly increased. Therefore, the early lead frame packaging technology is no longer suitable for high-density metal pins; therefore, a ball grid array (BGA) packaging technology has been developed. The ball array package has the advantage of higher density than the lead frame package. In addition, its solder balls are less prone to damage and deformation. [0003] With the popularity of 3C products, such as: mobile phone (Cell Phone), personal digital assistant (PDA) or iPod, etc., it...

AI Technical Summary

Problems solved by technology

The thinned grains are redistributed on another substrate, and then a plurality of grains are formed into a colloid by injection molding; because the grains are very thin, the encapsulant is also very thin, so when After the sealant is separated from the substrate, the stress of the sealant itself will cause the sealant to warp, increasing the difficulty of the subsequent cutting process

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