Recovery method of waste circuit board value resource

A waste circuit board and recycling method technology, applied in electronic waste recycling, recycling technology, solid waste removal and other directions, can solve the problems of incomplete solder recycling, low recycling efficiency, strict temperature requirements, etc. The effect of conditions, low recovery cost, and easy control of conditions

Inactive Publication Date: 2010-07-14
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] 1. In the process of recycling solder after heating waste circuit boards with oil, if the heating temperature is too low, the solder recovery will not be complete, and if the heating temperature is too high, the circuit board will be cracked in the oil, and the temperature requirements are relatively strict
[0017] 2. Disposal of waste circuit boards in oil, due to the large volume of block circuit boards, the amount of each treatment is small, and the recovery efficiency is not high

Method used

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  • Recovery method of waste circuit board value resource
  • Recovery method of waste circuit board value resource
  • Recovery method of waste circuit board value resource

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Put the waste circuit boards into the vacuum pyrolysis device and vacuumize. The following experimental conditions were set: the final temperature of cracking was 500°C, the holding time of the final temperature was 20min, and the condensation temperature was -20°C. Heat the vacuum pyrolysis device, collect the obtained liquid oil and the solid product of waste circuit board cracking; then put the solid product of waste circuit board cracking into a vacuum centrifuge, raise the temperature to 250°C, and rotate for 10 minutes after the temperature is constant. The rotation speed was 600 rpm.

[0046] in conclusion:

[0047] ①In the vacuum pyrolysis step, the oil yield was 21.26%.

[0048] ② During the solder recovery step, a large number of electronic components fall off, and only a few electronic components are attached to the circuit board; a large amount of solder falls off, and a small amount of solder remains on the cracked substrate.

Embodiment 2

[0050] Put the waste circuit boards into the vacuum pyrolysis device and vacuumize. The following experimental conditions were set: final cracking temperature of 550°C, final temperature holding time of 30min, and condensation temperature of -30°C. Heat the vacuum pyrolysis device, collect the obtained liquid oil and the solid product of waste circuit board cracking; then put the solid product of waste circuit board cracking into a vacuum centrifuge, raise the temperature to 350°C, and rotate for 10 minutes after the temperature is constant. The rotation speed was 800 rpm.

[0051] in conclusion:

[0052] ①In the vacuum pyrolysis step, the oil yield was 22.12%.

[0053] ②In the process of recycling solder, a large number of electronic components fall off, and only a very small number of electronic components are attached to the circuit board; a large amount of solder falls off, and a very small amount of solder remains on the cracked substrate.

Embodiment 3

[0055] Put the waste circuit boards into the vacuum pyrolysis device and vacuumize. The following experimental conditions were set: final cracking temperature 600°C, final temperature holding time 40min, condensation temperature -40°C. Heat the vacuum pyrolysis device, collect the obtained liquid oil and the solid product of waste circuit board cracking; then put the solid product of waste circuit board cracking into a vacuum centrifuge, raise the temperature to 350°C, and rotate for 10 minutes after the temperature is constant. The rotation speed was 1000 rpm.

[0056] in conclusion:

[0057] ①In the vacuum pyrolysis step, the oil yield is 22.58%.

[0058] ②In the solder recovery step, the electronic components are completely removed, and no electronic components are attached to the circuit board; the solder is completely removed, and no solder remains on the substrate.

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Abstract

The invention disclose a recovery method of valuable resource of an abandoned circuit board, which comprises the following steps of: (1) vacuum cracking: the abandoned circuit board provided with an electronic component is placed inside a vacuum cracking device for thermal cracking and volatile products after thermal cracking are collected and condensed to be fluid oil; (2) heating vacuum centrifugation: solid-state products after cracking are placed inside a vacuum centrifugation machinery and heated so as to lead soldering tin to be separated from cracking dregs efficiently; and (3) the collection of the cracking dregs obtained from the step (2): noble metal and other valuable metals are collected respectively and substances of copper foil, glass fibers, carbon residue and the like are recovered discretely. The invention carries out treatment in phases according to the structural characteristics of the abandoned circuit board, optimizes the treatment procedures and conditions of theabandoned circuit board and is simple in method, and leads the recovery of the abandoned circuit board to have lower cost, higher efficiency and higher recovery rate of the abandoned resource, thus being more in accordance with the demands of industrialization and applicable to large-scale recovery of the abandoned circuit board.

Description

Technical field: [0001] The invention discloses a method for recycling valuable resources of discarded circuit boards, and belongs to the technical field of resource recycling and reuse of discarded electronic and electrical products. Background technique [0002] The present invention is a recycling process researched and developed for a large number of waste printed circuit boards (printed circuit board, PCB). With the rapid development of the economy and the electronic information industry, the replacement of electronic and electrical products is increasing, and the service life of the products is shortened, resulting in a large number of electronic products being discarded. Waste printed circuit boards are a major part of electronic waste, and their recycling has become a global problem that needs to be solved urgently. Discarded circuit boards are different from general solid waste. In addition to precious metals and other valuable metals, they also contain lead, cadmi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10G1/00B09B3/00C22B15/00
CPCY02P10/20Y02W30/82
Inventor 丘克强周益辉
Owner CENT SOUTH UNIV
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