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Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de

A technology of optical semiconductor components and optical semiconductors, which is applied in the fields of semiconductor/solid-state device parts, semiconductor/solid-state device manufacturing, semiconductor devices, etc. changes, etc.

Inactive Publication Date: 2009-05-13
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, although a sealant containing an epoxy-modified silicone resin having such a structure has high transmittance to short-wavelength light from blue to ultraviolet regions and is excellent in light resistance, heat resistance is not sufficient, and , if the sealant is exposed to high temperature, there will be a problem of thinning the film of the sealant
Once the film of this sealant is thinned, the optical characteristics of the light-emitting element will gradually change with the thinning of the sealant film, so it is difficult to use it in headlights or lighting for automobiles that require high optical characteristics. in use

Method used

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  • Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de
  • Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de
  • Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0252] Add dimethyldimethoxysilane (750g) and 3-glycidoxypropyl(methyl)dimethoxysilane (150g) to a 2000mL separable flask equipped with a thermometer and a dripping device. , Stir at 50°C. Potassium hydroxide (1.9g) / water (250g) was slowly added dropwise thereto, and after the dropwise addition, the mixture was stirred at 50°C for 6 hours. Acetic acid (2.1 g) was added thereto, volatile components were removed under reduced pressure, and potassium acetate was filtered to obtain a polymer. The obtained polymer was washed with hexane / water, volatile components were removed under reduced pressure, and polymer A was obtained. The molecular weight of polymer A is Mn=11000, Mw=25000, and according to 29Si-NMR, it is (Me 2 SiO 2 / 2 ) 0.90 (EpMeSiO 2 / 2 ) 0.10 , The content of 3-glycidoxy propyl group is 14 mol%, and the epoxy equivalent is 760g / eq. The alkoxy content is 0.2 mol%.

[0253] In addition, the molecular weight is that tetrahydrofuran (1 mL) was added to polymer A (10 mg), stirr...

Synthetic example 2

[0255] Add dimethyldimethoxysilane (540g), 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (60g) to a 2000mL separable flask equipped with a thermometer and a dripping device. ), stirring at 50°C. Potassium hydroxide (1.3g) / water (175g) was slowly added dropwise thereto, and after the dropwise addition, the mixture was stirred at 50°C for 6 hours. Acetic acid (1.4 g) was added thereto, volatile components were removed under reduced pressure, and potassium acetate was filtered to obtain a polymer. The obtained polymer was washed with hexane / water, volatile components were removed under reduced pressure, and polymer B was obtained. The molecular weight of polymer B is Mn=2100, Mw=7300, and according to 29Si-NMR, it is (Me 2 SiO 2 / 2 ) 0.94 (EpSiO 3 / 2 ) 0.06 , The 2-(3,4-epoxycyclohexyl) ethyl content is 9 mol%, and the epoxy equivalent is 1270 g / eq. The alkoxy content is 1.5 mol%.

[0256] In addition, the molecular weight, epoxy equivalent, and alkoxy content of polymer B were obtained...

Synthetic example 3

[0258] Add dimethyldimethoxysilane (440g) and 3-glycidoxypropyltrimethoxysilane (160g) to a 2000mL separable flask equipped with a thermometer and a dripping device, at 50℃ Stir. Potassium hydroxide (1.2g) / water (170g) was slowly added dropwise thereto, and after the dropwise addition, the mixture was stirred at 50°C for 6 hours. Acetic acid (1.3 g) was added thereto, volatile components were removed under reduced pressure, and potassium acetate was filtered to obtain a polymer. The obtained polymer was washed with hexane / water, volatile components were removed under reduced pressure, and polymer C was obtained. The molecular weight of polymer C is Mn=2000, Mw=3800, and according to 29Si-NMR, it is (Me 2 SiO 2 / 2 ) 0.83 (EpSiO 3 / 2 ) 0.17 The content of 3-glycidoxy propyl group is 22 mol%, and the epoxy equivalent is 550g / eq. The alkoxy content is 4 mol%.

[0259] In addition, the molecular weight, epoxy equivalent, and alkoxy content of polymer C were obtained in the same manner as...

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Abstract

To provide a thermosetting composition for an optical semiconductor which is highly transparent, is free-from decrease in thickness or discoloration of a cured product due to heat generation or light emitting of a light emitting device, is superior in heat resistance and lightfastness, and has excellent adhesion to a housing material or the like, a sealing agent for an optical semiconductor device and a die bond material for an optical semiconductor device using the same, and an optical semiconductor device obtained by using the thermosetting composition for an optical semiconductor, the sealing agent for an optical semiconductor, the die bond material for an optical semiconductor device and / or the underfill material for an optical semiconductor device. A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2), the content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol%: [formula 1] (R<1>R<2>SiO2 / 2) (1) and [formula 2] (R<3>SiO3 / 2) (2).

Description

Technical field [0001] The present invention relates to a heat for optical semiconductors with high transparency, no film thinning or discoloration caused by heat or light emission of light-emitting elements, excellent heat resistance and light resistance, and excellent adhesion to housing materials, etc. The curable composition, the sealing agent for optical semiconductor elements, the die bond material for optical semiconductor elements and the thermosetting composition for optical semiconductors, the sealing agent for optical semiconductors, the optical semiconductor element Optical semiconductor components made of die-bonding materials and / or underfill materials for optical semiconductor components. Background technique [0002] Light-emitting elements such as light-emitting diodes (LEDs) and other optical semiconductor elements have their light-emitting characteristics drastically reduced due to moisture or suspended dust in the air once they are in direct contact with the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32C08G77/14C08L83/06H01L21/52H01L23/29H01L23/31H01L33/00
CPCH01L2224/73204H01L2224/73265
Inventor 谷川满渡边贵志西村贵史
Owner SEKISUI CHEM CO LTD