Optical semiconductor encapsulating material
A sealing material and optical semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, coatings, etc., can solve the problems of poor adhesion, low refractive index of silicone resin, low light acquisition efficiency, etc., to achieve adhesion Excellent, excellent transparency, hardly yellowing effect
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Embodiment 1
[0077] 25 g of 1-adamantyl methacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) as (B) component and 25 g of polyethylene glycol #400 dimethacrylate (a-3) as (A) component ) [New Nakamura Chemical Industry Co., Ltd., trade name: NK Ester 9G, number average molecular weight 540], add 0.2 g of 1,1-bis(tert-hexyl peroxy) cyclohexane [Nippon Oil Co., Ltd. , trade name: パ-ヘキサ HC] and 0.2 g bis(4-tert-butylcyclohexyl) peroxydicarbonate [manufactured by NOF Corporation, trade name: パ-ヘキイルTCP] as (C) component, mixed, prepared into a curable photo-semiconductor sealing material. A spacer made of Teflon (registered trademark) with a thickness of 3 mm is sandwiched between two glass plates to form a groove, and the curable semiconductor sealing material is poured into the groove or figure 1 The recessed part of the part shown was heated in an oven at 70°C for 3 hours and then at 160°C for 1 hour, and then cooled to room temperature to obtain a colorless and transpar...
Embodiment 2
[0079] In 25 g of 1-adamantyl methacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) as component (B) and 25 g of hydrogenated polybutadiene diacrylate (a-2) as component (A) [Shin-Etsu Prepared by Chemical Industry Co., Ltd., trade name: SPBDA S30], add 0.2 g of 1,1-bis(tert-hexyl peroxy) cyclohexane [prepared by Nippon Oil Co., Ltd., trade name: パ-ヘキサ HC] and 0.2 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate [manufactured by NOF Corporation, trade name: Pa-Roil TCP] was mixed as component (C) to prepare a curable optical semiconductor sealing material. A spacer made of Teflon (registered trademark) with a thickness of 3 mm is sandwiched between two glass plates to form a groove, and the curable semiconductor sealing material is poured into the groove or figure 1 The concave portion of the part shown was heated in an oven at 70°C for 3 hours, then at 160°C for 1 hour, and then cooled to room temperature to obtain a colorless and transparent plate-like c...
Embodiment 3
[0081] 25 g of 1-adamantyl methacrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.) as (B) component and 25 g of (3-acryloyloxy-2-hydroxypropyl) as (A) component Add 0.2 g of 1,1-bis(tert-hexylperoxy)cyclohexane [NOF Co., Ltd., trade name: パ-ヘキサ HC] and 0.2 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate [manufactured by NOF Co., Ltd., trade name: パ-ヘイルTCP] as (C) component , mixed to make a curable photo-semiconductor sealing material. A spacer made of Teflon (registered trademark) with a thickness of 3 mm is sandwiched between two glass plates to form a groove, and the curable semiconductor sealing material is poured into the groove or figure 1 The concave portion of the part shown was heated in an oven at 70°C for 3 hours, then at 160°C for 1 hour, and then cooled to room temperature to obtain a colorless and transparent plate-like cured product. Table 1 shows the physical property evaluation results of the obtained semiconductor sealing material and cu...
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