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Electronic package and method of preparing same

A technology of electronic components and electronic devices, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of barrier coating cracking, reducing the effectiveness of coatings and device reliability, etc., and achieve the effect of low compressive stress

Inactive Publication Date: 2009-06-17
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thermal stress can cause barrier coating cracks, reducing coating effectiveness and device reliability

Method used

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  • Electronic package and method of preparing same
  • Electronic package and method of preparing same
  • Electronic package and method of preparing same

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Experimental program
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preparation example Construction

[0039] The method for preparing electronic components of the present invention comprises:

forming a first inorganic barrier coating over a substrate and at least one electronic device having electrical connections disposed on or within the substrate;

forming a first interfacial coating on the first inorganic barrier coating in a region above the electronic device, wherein the first interfacial coating comprises a cured product of a silicone resin; and

forming a second inorganic barrier coating on the first interfacial coating and on any portion of the first inorganic barrier coating not covered by the first interfacial coating; provided that at least a portion of each electrical connection is not coated .

[0040] According to the aforementioned method of making an electronic assembly, a first inorganic barrier coating is formed on a substrate and at least one electronic device having electrical connections, wherein the electronic device is disposed on or within the substr...

Embodiment 1

[0171] Toluene (2400g), 2.40mol of 3-glycidoxypropyltrimethoxysilane, 4.80mol of methyltrimethoxysilane, 28.8mol of water, 2.4mL of tetramethylammonium hydroxide (25% aqueous solution ), and the methanol of 2400g are combined in the flask. The mixture was stirred and heated to reflux for 2 hours during which time 6950 g of solvent, mainly methanol, was removed by distillation using a Dean-Stark trap. During the distillation, toluene was added to the mixture to maintain a constant resin concentration. The temperature of the mixture was slowly raised to about 110°C over the course of about 1 hour. The mixture was then allowed to cool to room temperature. Acetic acid (3.4 mL) was then added dropwise to the stirred mixture over a period of 1 hour. The mixture was washed with 1,600 mL of deionized water (ten times), then filtered. Toluene was removed under reduced pressure using a rotary evaporator at 40 °C. The residue was placed under vacuum (1 Pa) at room temperature for 3 ...

Embodiment 2

[0172] Toluene (80 g), 0.20 mol of 3-methacryloxypropyltrimethoxysilane, 0.40 mol of phenyltrimethoxysilane, 2.40 mol of water, 1 g of 50% (w / w) hydrogen An aqueous cesium solution, 200 g of methanol, and 40 mg of 2,6-di-tert-butyl-4-methylphenol were combined in a flask. The solution was heated to reflux for 1 hour during which time 250 g of solvent was removed by distillation using a Dean-Stark trap, mainly methanol. During the distillation, toluene was added to the mixture to maintain a constant resin concentration. The temperature of the mixture was slowly raised to about 105°C over the course of about 1 hour. The mixture was then allowed to cool to room temperature. Toluene was removed under reduced pressure using a rotary evaporator at 40 °C. The residue was placed under vacuum (1 Pa) at room temperature for 3 hours to obtain a silicone resin of the formula:

(PhSiO 3 / 2 ) 0.67 (CH 2 =C(CH 3 )C(=O)OCH 2 CH 2 CH 2 SiO 3 / 2 ) 0.33 ,

as passed 29 Si NMR and 1...

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Abstract

An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.

Description

[0001] Cross References to Related Applications [0001] This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application 60 / 811,223, filed June 05, 2006. US Provisional Patent Application 60 / 811,223 is incorporated herein by reference. technical field [0002] The present invention relates to electronic assemblies, and more particularly, to electronic assemblies comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a silicone resin cured product. The invention also relates to methods of producing electronic components. Background technique [0003] Barrier coatings play a major role in a variety of applications, including electronics assembly, food packaging, and surface treatment, by protecting sensitive materials from air, moisture, and environmental contaminants. In particular, barrier coatings are often applied to electronic devices t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/31G03F7/075
CPCH01L2924/13091H01L23/296G03F7/0757H01L23/3192G03F7/0758H01L2924/19041H01L2924/12044H01L2924/09701H01L2924/13063H01L2924/13055H01L2924/0002Y10T428/265Y10T428/31504H01L2924/00G03F7/075H01L23/29H01L23/31
Inventor J·阿尔鲍R·加米勒迪
Owner DOW CORNING CORP
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