Compositions for removal of etching residues
A technology for etching residues and compositions, which is applied in the preparation of detergent mixture compositions, detergent compositions, organic cleaning compositions, etc. Simultaneous control of metal and non-metal etch rates and other issues
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Embodiment 1~14
[0041] Table 1 provides the formulas of the cleaning solution composition examples 1 to 14 for plasma etching residues in the semiconductor industry. According to the components listed in Table 1 and their contents, simply mix them uniformly to obtain each cleaning solution .
[0042] Table 1 is used for the cleaning solution composition embodiment 1~14 of plasma etch residue in semiconductor industry
[0043]
[0044]
[0045] Wherein, NMP is N-methylpyrrolidone, DMSO is dimethylsulfoxide, DMAC is dimethylformamide, Sulf is sulfolane, and BTA is benzotriazole.
Embodiment 15
[0047] Table 2 shows the etching rate when the cleaning solution in Example 1 is used to form different substances and different temperatures.
[0048] Table 2
[0049]
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