Polyimide film, and method for production thereof

A technology of polyimide film and manufacturing method, applied in the direction of chemical instruments and methods, other household appliances, synthetic resin layered products, etc., capable of solving the problem of property degradation, operability degradation, foaming of polyimide film, etc. Problems, achieve fast film-making speed, reduce heat energy and heating time, and reduce the effect of tensile physical properties

Active Publication Date: 2009-08-05
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of a self-supporting film of a polyimide precursor solution obtained from 3,3',4,4'-biphthalic dianhydride and p-phenylenediamine, if the If the film is formed, the physical properties such as the initial elastic modulus of the obtained self-supporting film will decrease, and the handling property will tend to decrease.
In addition, the resulting polyimide film may be weakened, foamed, or crystals may be formed in the film, resulting in a decrease in properties.
[0008] In addition, on the other hand, there is usually a problem with the adhesiveness of the polyimide film, and when it is bonded to metal foils such as copper foil through heat-resistant adhesives such as epoxy resin adhesives, it may not be possible to obtain sufficient adhesive properties. Laminates with a peel strength of

Method used

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  • Polyimide film, and method for production thereof
  • Polyimide film, and method for production thereof
  • Polyimide film, and method for production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0097] Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples.

[0098] The physical properties of the self-supporting film and the polyimide film were evaluated according to the following methods.

[0099] (1) Initial elastic modulus, breaking strength, and breaking elongation of self-supporting film and polyimide film

[0100] The film was punched into the shape of a dumbbell (dumb-bell) according to the IEC450 standard. As a test piece, TENSILON manufactured by ORIENTEC was used to measure the initial modulus of elasticity, breaking strength, elongation at break.

[0101] (2) Imidization rate of self-supporting film

[0102]Using the Magna550FT-IR manufactured by Nikolai (Nikore), the FT-IR spectrum of the self-supporting film and its fully matured film (polyimide film) was measured using Ge crystal (GE Crystal) and the ATR method at an incident angle of 45°. Use 1775cm -1 The peak h...

Embodiment 1～19

[0139] (Examples 1-19, Reference Examples 1-4)

[0140] As the aromatic diamine component, in addition to p-phenylenediamine, 2,4-toluenediamine (TDA) was used in the amount shown in Table 1, and the solid content concentration and / or preparation of the polyimide precursor solution Except having changed the film velocity as shown in Table 1, it carried out similarly to the comparative example 1, and obtained the polyimide film.

[0141] In the table, the film forming speed is represented by the multiplication rate relative to the film forming speed of Comparative Example 1. Similarly to Comparative Examples 2 to 12, the heating time in each step of casting and aging shown in Comparative Example 1 was shortened equally in order to make the film forming rate the multiplication rate shown in the table. In addition, the usage-amount of 2, 4- toluenediamine is shown by the ratio with respect to the whole aromatic diamine component (PPD+TDA).

[0142] Table 1 shows the physical pr...

Embodiment 20～22

[0152] Carry out in the same manner as Examples 9-11, prepare the polyimide precursor solution composition that the solid content concentration is 24% by mass, introduce 10 mol% TDA, and cast it continuously from the gap of the T die head metal type. Films are formed by extrusion on a smooth metal support in a drying oven. Next, the film was heated at 155° C. for a predetermined time, and then peeled from the support to obtain a self-supporting film.

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PUM

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Abstract

Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3',4,4'-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.

Description

technical field [0001] The present invention relates to a polyimide film excellent in productivity and a method for producing the polyimide film. Moreover, this invention also relates to the polyimide film which maintains the outstanding characteristic of a polyimide film, and is also excellent in adhesiveness. Background technique [0002] Polyimide films are widely used in fields such as electric and electronic device fields and semiconductor fields due to their excellent heat resistance, chemical resistance, mechanical strength, electrical characteristics, and dimensional stability. For example, as a flexible printed circuit board (FPC), a copper foil laminated substrate in which copper foil is laminated on one or both surfaces of a polyimide film is used. [0003] As a polyimide film preferably used as a film for FPC, etc., thermal imidization is used to obtain an aromatic diphthalic acid dianhydride mainly composed of 3,3',4,4'-diphthalic dianhydride. A polyimide film...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18B32B15/08
CPCB32B27/34B32B15/08C08L79/08H05K1/0346C08G73/1042C08G73/1067H05K2201/0154B32B7/12B32B15/20B32B27/16B32B27/281B32B2307/20B32B2307/306B32B2307/50B32B2307/54B32B2307/714B32B2307/724B32B2307/734B32B2457/00B32B2457/04B32B2457/08B32B2457/12Y10T428/31681C08G73/10C08J5/08
Inventor 山口裕章幸田政文久野信治薮中津介
Owner UBE IND LTD
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