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White cured resin composition and printed circuit board having insulation layer formed with the same

A curable resin, printed circuit board technology, applied in printed circuits, printed circuit parts, circuit substrate materials, etc., can solve the problems of titanium oxide sedimentation and uneven composition, and achieve excellent light reflectivity and storage stability. Effect

Active Publication Date: 2009-09-30
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the addition amount of titanium oxide used for coloring white is larger than that of pigments generally used, so there is a possibility that precipitation of titanium oxide is likely to occur during storage of the white curable resin composition containing titanium oxide, resulting in uneven composition. question

Method used

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  • White cured resin composition and printed circuit board having insulation layer formed with the same
  • White cured resin composition and printed circuit board having insulation layer formed with the same
  • White cured resin composition and printed circuit board having insulation layer formed with the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Each component of Table 1 and Table 2 was kneaded with a three-roll mill to obtain each thermosetting resin composition (composition examples 1 to 24). The numbers in the table represent parts by mass. Among composition examples 1 to 24, examples 9 to 13 and 21 to 24 did not contain phthalocyanine.

[0071] Table 1 (Thermosetting resin composition)

[0072]

[0073] Table 2 (photocurable composition)

[0074]

[0075] 〔Sedimentation test〕

[0076] ·Evaluation method

[0077] Put each composition of curable resin composition examples 1 to 24 into a black polyethylene container (Hi-Bessel No. 1100 manufactured by Kinki Container Co., Ltd.) with a capacity of about 1150 ml so that the depth is 6 cm, cover and seal it, and set it at 20 Store in the dark at ℃ for 90 days. About each composition after storage, the state of sedimentation was measured as follows using the Dynometer by Byk-Gardner company.

[0078] Install a rod-shaped probe (for high sensitivity) in...

Embodiment 2

[0102] Example 2 (Physical Properties of Thermosetting Composition)

[0103] After carrying out the sedimentation test of each thermosetting composition of Examples 1 to 8 containing phthalocyanine, it was pattern-printed by screen printing on an FR-4 substrate on which a circuit was formed so that the dry coating film was about 40 μm, and cured at 150°C. After 60 minutes, a substrate for a characteristic test was prepared.

[0104] As a solvent resistance test, the substrate for the property test was immersed in propylene glycol monomethyl ether acetate for 30 minutes, dried, and then subjected to a peeling test of the glass adhesive tape. The solvent resistance was confirmed by the absence of peeling and discoloration of the coating film.

[0105] Next, as a heat resistance test, a rosin-based flux was applied to the substrate for the characteristic test, flowed in a solder tank at 260°C for 10 seconds, washed with propylene glycol monomethyl ether acetate, dried, and then s...

Embodiment 3

[0109] Embodiment 3 (physical property of photocurable composition)

[0110] After carrying out the sedimentation test of each of the photocurable compositions of Examples 14 to 20 containing phthalocyanine, the pattern was printed by screen printing on the FR-4 substrate with the circuit formed so that the dry coating film was about 40 μm, and the metal halide lamp was used to Irradiate 2J / cm at the measurement wavelength centered at 350nm 2 The cumulative amount of light is cured to produce a substrate for characteristic testing.

[0111] As a solvent resistance test, the substrate for the property test was immersed in propylene glycol monomethyl ether acetate for 30 minutes, dried, and then subjected to a peeling test of the glass adhesive tape. The solvent resistance was confirmed by the absence of peeling and discoloration of the coating film.

[0112] Next, as a heat resistance test, a rosin-based flux was applied to the substrate for the characteristic test, flowed in ...

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Abstract

The present invention provides a white cured resin composition and printed circuit board having insulation layer formed with the same. The white cured resin composition for the printed circuit board contains titanium oxide with high content and holds excellent stability. The white cured resin composition for the printed circuit board contains (A) cured resin, (B) titanium oxide and (C) phthalocyanine; and the printed circuit board, which has insulation layer formed with the white cured resin composition.

Description

technical field [0001] The present invention relates to: a white curable resin composition for a printed wiring board suitable as an insulating layer of a printed wiring board on which a light-emitting element such as a light emitting diode (LED) is mounted; and printing of an insulating layer having a cured product of the composition circuit board. Background technique [0002] In recent years, among printed circuit boards, backlights of liquid crystal displays such as portable terminals, computers, and televisions, and light sources of lighting fixtures have been used directly on LEDs that emit light at low power. (For example, refer to Patent Document 1). . [0003] In this case, in addition to the characteristics such as solvent resistance, hardness, solder heat resistance, and electrical insulation that are generally required for solder resist films, the insulating film formed on the printed wiring board as a protective film has excellent light reflectance. A white in...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027H05K1/00C08K3/22C08K5/3415C08L101/00H01L33/48H05K1/03
Inventor 大胡义和宇敷滋
Owner TAIYO INK MFG
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