Thermally conductive resin composition

Abstract

The present invention discloses an insulating material having high thermal conductivity, which is excellent in moldability and abrasion characteristics. Specifically disclosed is an insulating material obtained by adding 10-200 parts by weight of a fibrous titanium oxide (B) having a thermal conductivity of not less than 3 W / m K and an aspect ratio of not less than 10, and 10-400 parts by weight of one or more plate-like, spherical or amorphous thermally conductive fillers (C) having a thermal conductivity of not less than 2 W / m K to 100 parts by weight of a liquid crystalline polymer (A) (provided that the total addition amount of the components (B) and (C) is 30-500 parts by weight per 100 parts by weight of the liquid crystalline polymer (A)). The thermal conductivity of the composition is set at not less than 0.8 W / m K.

Description

technical field [0001] The present invention relates to an insulating thermally conductive resin composition excellent in moldability and wear characteristics, and more specifically, to a thermally conductive resin composition used in various automotive parts, electrical and electronic parts, etc. requiring heat dissipation. Excellent liquid crystalline polymer composition. Background technique [0002] A liquid crystalline polymer capable of forming an anisotropic melt phase is known as a material excellent in dimensional accuracy and damping properties among thermoplastic resins, and which generates very little burr during molding. Currently, a liquid crystalline polymer composition utilizing such characteristics and reinforced with glass fibers is widely used as a material for various electrical and electronic parts. However, in recent years, these parts have become lighter, thinner and shorter, and internal heat dissipation of the parts and the like has become a problem...

AI Technical Summary

Problems solved by technology

However, in recent years, these parts have become lighter, thinner and shorter, and the internal heat dissipation of parts, etc. has become a problem, and materials that impart heat dissipation are increasingly required.

[0003] For this reason, a method of adding alumina with a specific particle size to thermoplastic resins to improve moldability and thermal conductivity has been proposed (Japanese Patent Application Laid-Open No. 2002-146187). , but due to the high Mohs hardness of alumina, when kneading with resin or molding, the extruder, the screw of the molding machine, the roller and the molding die are severely worn, which leads to metal mixing

[0004] On the other hand, a method of adding graphite to a liquid crystalline polymer to impart thermal conductivity has been proposed (Japanese Unexamined Patent Application Publication No. 2006-257174 ). However, this method has a problem in that, although the wear of the screw or the like due to the filler does not occur, , but it cannot be used in fields that require electrical insulation because it imparts electrical conductivity as well as thermal conductivity

[0005] In addition, a method of adding a thermally conductive filler having an aspect ratio of 5 or more to a thermoplastic resin has been proposed (Japanese Unexamined Patent Publication No. 2006-116894), but only PBO (polybenzoxazole, polybenzoxazole) fibers are listed as an example. , there is no research on other fibrous thermally conductive fillers, and when only fibrous fillers are used, when a large amount of fillers are added to improve thermal conductivity, there is a problem that the fluidity will drop significantly

[0006] In addition, adding amorphous titanium oxide to thermoplastic resins to improve light reflectivity, light-shielding properties, or as a photocatalyst has been proposed (Japanese Patent Laid-Open No. 2004-75770 and Japanese Patent Laid-Open No. 2003-253130 Bulletin), but these documents did not study the improvement of thermal conductivity

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