Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printing wiring cardinal plate and method for producing the same

A technology of printed wiring and manufacturing methods, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of low chromium content, short circuit, insufficient insulation reliability, etc., and achieve excellent corrosion resistance, Ensuring insulation reliability and high utility value

Active Publication Date: 2009-12-02
SUMITOMO METAL MINING CO LTD
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Substrates with the above-mentioned etching residues and flexible printed wiring boards using a base metal layer with a low chromium content clearly show insufficient insulation reliability in the HHBT test
[0012] That is, for a two-layer resin-film-metal-film laminate substrate having a base metal layer with a high chromium content, when performing the above-mentioned chemical etching treatment, when the base metal layer such as nickel-chromium alloy is insufficiently etched and remains dissolved, when the HHBT test is performed , Adjacent conductor wiring, due to the metal residue composed of the remaining base metal layer components dissolved between the wiring, the problem of short circuit occurs
[0013] On the other hand, the use of a two-layer resin film metal film laminated substrate with a base metal layer with a low chromium content does not generate etching residues, but since the corrosion resistance of the base metal layer cannot be ensured, reliable insulation in the HHBT test cannot be ensured. sex

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printing wiring cardinal plate and method for producing the same
  • Printing wiring cardinal plate and method for producing the same
  • Printing wiring cardinal plate and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] A polyimide film with a thickness of 38 μm (“Kapton 150EN” manufactured by Toray Dupont Co., Ltd.) was placed on the sputtering device, and the vacuum was exhausted to 1×10 -1 After Pa, heat the polyimide film with an infrared heater, remove the moisture in the film, and then vacuum exhaust to 1×10 -4 Pa. Next, Ar gas was introduced to maintain the pressure in the apparatus at 0.3 Pa, and a Ni-7 mass % Cr layer with a film thickness of 10 nm and a Ni-18 The mass % Cr-10 mass % Mo layer and the copper film layer with a film thickness of 0.1 μm were taken out from the sputtering apparatus. Next, a copper layer with a film thickness of 8 μm was formed on the copper film layer by electroplating to obtain an insulating film metal film laminated body 1 .

[0136] A peel strength measurement sample and an insulation reliability measurement sample were manufactured from the obtained resin film metal film laminated substrate 1, and each test was provided.

[0137] Since the i...

Embodiment 2

[0141] In addition to using Ni-7 mass % Cr with a film thickness of 3 nm for the metal layer B, and Ni-20 mass % Cr with a film thickness of 10 nm for the metal layer C, the resin film metal film laminated substrate 2 obtained by forming a metal film, and the implementation Samples were produced in the same manner as in Example 1, and various tests were performed. Table 1 shows the results.

Embodiment 3

[0143] Samples were produced in the same manner as in Example 1, except that the metal layer B was made of Ni with a film thickness of 5 nm, and the metal layer C was formed with a metal film of Ni-20 mass % Cr with a film thickness of 20 nm. , each test was carried out, and the results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a printing wiring cardinal plate with high insulation reliability and corrosion resistance and method for producing the same, namely the conductor wiring is formed with high etching, when etching is performed by ferric chloride solution or hydrochloric acid solution of copper chloride, residual etching draff with ingredients of the base metal layer between the conductor wirings are few, when high voltage is exerted among the conductor wirings. On at least one surface of the insulating resin film A, a metallic layer B with nickel, or nickel-chromium alloy containing nickel above 70 quality percentage and chromium below 15 quality percentage is stacked in series without an adhesive agent; a metallic layer C made of alloy containing chromium over 15 weight percentage, unnecessary part of a metal membrane composed by copper tunica layer D with thickness 10 nm to 35 Mum, chemical etching processing is adopted for selective removal, and then the printing wiring cardinal plate of conductor wirings is formed.

Description

technical field [0001] The present invention relates to a printed wiring board and its manufacturing method. More specifically, it relates to sequentially forming a metal layer with good etching properties and a metal layer with high corrosion resistance between an insulating resin film and a copper film layer by a dry plating method. , A printed wiring board having high insulation reliability and a method for manufacturing the same. Background technique [0002] Flexible printed wiring boards are broadly classified into: a three-layer resin film metal film laminated board in which copper foil as a conductor layer is bonded to an insulating resin film with an adhesive (for example, refer to Patent Document 1); It is a two-layer resin film metal film laminated board in which the copper film layer as the conductor layer is directly formed on the resin film by dry plating or wet plating without using an adhesive. [0003] However, in recent years, with the increase in the dens...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/09H05K3/06B32B15/08B32B15/20
CPCH05K3/06H05K3/188H05K2203/0369H05K2203/0723
Inventor 渡边宽人永尾晴美
Owner SUMITOMO METAL MINING CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com