Silicon thin film solar cell and preparation method thereof
A technology for solar cells and silicon thin films, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of poor repeatability and uniformity, difficult large-scale industrial production, and high substrate requirements, and achieve reduced substrate costs and low costs. , the effect of simple process
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Embodiment 1
[0013] Take a piece of clean FTO conductive glass as a substrate, deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence by plasma enhanced chemical vapor deposition (PECVD), and then deposit p-type Si film by screen printing method, On the p-type Si film, plasma-enhanced chemical vapor deposition (PECVD) was used to deposit i-type amorphous silicon film and n-type amorphous silicon film in sequence, and finally a layer of FTO transparent conductive film was deposited by magnetron sputtering. Laser grooving and buried gate lead out electrodes from p-type si film, FTO transparent conductive film and substrate respectively, that is, the required silicon thin film solar cell is produced.
Embodiment 2
[0015] Take a piece of clean ITO conductive glass as a substrate, and use plasma enhanced chemical vapor deposition (PECVD) to deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence, and then use spraying method to deposit p-type Si film. The i-type amorphous silicon film and the n-type amorphous silicon film were sequentially deposited on the si-type thin film by plasma-enhanced chemical vapor deposition (PECVD). The grid leads electrodes from the p-type Si thin film, ITO transparent conductive thin film and the substrate respectively, that is, the required silicon thin film solar cell is produced.
Embodiment 3
[0017] Take a piece of clean FTO conductive glass as a substrate, use plasma enhanced chemical vapor deposition (PECVD) to deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence, and then use spraying method to deposit p-type Si film, and then deposit p-type Si film on p The i-type amorphous silicon film and the n-type amorphous silicon film were sequentially deposited on the si-type thin film by plasma-enhanced chemical vapor deposition (PECVD), and finally a layer of ITO transparent conductive film was deposited by magnetron sputtering. The trench buried gate leads out the electrodes from the p-type Si thin film, the ITO transparent conductive thin film and the substrate respectively, that is, the required silicon thin film solar cell is produced.
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Abstract
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