Silicon thin film solar cell and preparation method thereof

A technology for solar cells and silicon thin films, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of poor repeatability and uniformity, difficult large-scale industrial production, and high substrate requirements, and achieve reduced substrate costs and low costs. , the effect of simple process

Inactive Publication Date: 2009-12-23
HUNAN NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are mainly two ways to prepare polysilicon thin films: one is to use chemical vapor deposition (CVD) technology to directly prepare polysilicon thin films on substrate materials; The substrate requirements are high; the second is to prepare an amorphous silicon film first, and then crystallize the amorphous silicon film into a polysilicon film through laser crystallization, solid-phase crystallization or rapid heat treatment crystallization; but the laser crystallization technology requires The equipment is complicated, the production cost is high, and it is difficult to realize large-scale industrial production; while the solid-phase crystallization technology generally requires the crystallization temperature to be above 600°C, which has certain requirements for the substrate, and the crystallization time is long; the rapid heat treatment technology is due to the temperature It rises quickly, it is easy to introduce high thermal stress, and its repeatability and uniformity are poor, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Take a piece of clean FTO conductive glass as a substrate, deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence by plasma enhanced chemical vapor deposition (PECVD), and then deposit p-type Si film by screen printing method, On the p-type Si film, plasma-enhanced chemical vapor deposition (PECVD) was used to deposit i-type amorphous silicon film and n-type amorphous silicon film in sequence, and finally a layer of FTO transparent conductive film was deposited by magnetron sputtering. Laser grooving and buried gate lead out electrodes from p-type si film, FTO transparent conductive film and substrate respectively, that is, the required silicon thin film solar cell is produced.

Embodiment 2

[0015] Take a piece of clean ITO conductive glass as a substrate, and use plasma enhanced chemical vapor deposition (PECVD) to deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence, and then use spraying method to deposit p-type Si film. The i-type amorphous silicon film and the n-type amorphous silicon film were sequentially deposited on the si-type thin film by plasma-enhanced chemical vapor deposition (PECVD). The grid leads electrodes from the p-type Si thin film, ITO transparent conductive thin film and the substrate respectively, that is, the required silicon thin film solar cell is produced.

Embodiment 3

[0017] Take a piece of clean FTO conductive glass as a substrate, use plasma enhanced chemical vapor deposition (PECVD) to deposit n-type amorphous silicon film and i-type amorphous silicon film in sequence, and then use spraying method to deposit p-type Si film, and then deposit p-type Si film on p The i-type amorphous silicon film and the n-type amorphous silicon film were sequentially deposited on the si-type thin film by plasma-enhanced chemical vapor deposition (PECVD), and finally a layer of ITO transparent conductive film was deposited by magnetron sputtering. The trench buried gate leads out the electrodes from the p-type Si thin film, the ITO transparent conductive thin film and the substrate respectively, that is, the required silicon thin film solar cell is produced.

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Abstract

The invention discloses a silicon thin film solar cell and a preparation method thereof. A plurality of layers of an n-type amorphous silicon film, an i-type amorphous silicon film and a p-type si film are sequentially overlapped on a transparent conducting substrate from bottom to top. The i-type amorphous silicon film, the n-type amorphous silicon film and a transparent conducting film (TCO) are sequentially overlapped on the p-type si film to prepare a double-junction silicon film solar cell; or a layer of Al film is directly deposited on the p-type si film to prepare a single-junction silicon film solar cell. The substrate has wide selection range and low cost, the photoelectric conversion efficiency is high, the deposition temperature is low and the technique is simple.

Description

technical field [0001] The invention relates to a silicon thin film solar cell and a preparation method thereof. Background technique [0002] Polycrystalline silicon thin-film solar cells not only have the characteristics of high efficiency, stability, non-toxicity, and abundant material sources of crystalline silicon solar cells, but also have the advantages of low cost, material saving, and simple process of thin-film solar cells, and have no light-induced degradation effect. That is, it has the dual advantages of crystalline silicon solar cells and amorphous silicon solar cells. At present, it is becoming a research hotspot all over the world. At present, there are mainly two ways to prepare polysilicon thin films: one is to use chemical vapor deposition (CVD) technology to directly prepare polysilicon thin films on substrate materials; The substrate requirements are high; the second is to prepare an amorphous silicon film first, and then crystallize the amorphous sili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/042H01L31/075H01L31/20H01L31/0445H01L31/076
CPCY02E10/50Y02E10/548Y02P70/50
Inventor 羊亿罗云荣
Owner HUNAN NORMAL UNIVERSITY
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