Flow field sensor and manufacturing method thereof

Abstract

The invention discloses a flow field sensor, which is characterized in that: the flow field sensor comprises a circuit board integrated with a conditioning circuit, and a sensitive material layer manufactured on the circuit board, wherein the sensitive material layer is electrically connected to the conditioning circuit. The manufacturing method can manufacture the sensor conditioning circuit and a sensor electrode by the standard circuit board process, so that the manufacturing process of the sensor is simple, and the manufacturing cost of the sensor is greatly reduced. The sensor has the advantages of small volume and light mass, can be easily assembled on the surface of an object, and is easy to realize array; the sensor has simple packaging, small thermal capacity, higher response speed and small heat dissipating capacity so as to reduce the power consumption of a system; and the manufacturing scheme taking the circuit board as a substrate allows the sensor to be directly integrated on the conditioning circuit, and greatly improves the integration level of the whole system.

Description

technical field [0001] The invention relates to the technical field of flow field sensors, in particular to a highly integrated flow field sensor for measuring wind speed / shear force and a manufacturing method thereof. Background technique [0002] Flow field measurement is required in many fields of national production and defense industry, especially in the field of aerospace. Wind speed / shear stress measurement is a key component of surface flow field measurement, so the study of flow field sensors is of great significance. Traditional wind speed measurement methods include pitot tube, hot wire, hot film and other measurement methods, among which the hot wire / hot film sensor used in the hot wire / hot film measurement method is a commonly used flow field sensor. [0003] With the development of microelectromechanical systems (referred to as MEMS), hot wire and hot film sensors based on MEMS technology began to appear. Platinum resistance Pt100 / Pt1000 is a typical type of ...

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Problems solved by technology

[0004] Although the existing thin-film platinum thermistors (such as Pt100 / Pt1000) can measure the surface flow field of objects, due to the use of ceramic packaging, the resistance volume is relatively large. In addition, the ceramic packaging also increases the heat capacity of the sensor and reduces the sensor’s temperature. Performance, so there are the following problems in the measurement of the surface flow field of objects:

[0005] (1) The size and weight are large, and it is not easy to use arrays on the surface of objects;

[0006] (2) The large heat capacity limits the dynamic performance of the sensor;

[0007] (3) Large heat capacity and large heat dissipation area, resulting in large power consumption;

[0008] (4) It is difficult to install on the surface of the object, and the integration with the measurement circuit is low

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