Semiconductor laser TO tube seat packaging beam compression process

A technology of lasers and semiconductors, applied in the direction of semiconductor lasers, lasers, devices for controlling output parameters of lasers, etc., can solve problems such as uncertainty, material waste cost, and complex compression process, so as to avoid grinding, simplify process steps, and shape the process The effect of improving efficiency

Inactive Publication Date: 2010-01-06
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
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Problems solved by technology

[0004] The present invention aims at the problems of complex beam compression process, uncertainty, material waste and high cost in the TO packaging process of existing semi

Method used

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  • Semiconductor laser TO tube seat packaging beam compression process
  • Semiconductor laser TO tube seat packaging beam compression process
  • Semiconductor laser TO tube seat packaging beam compression process

Examples

Experimental program
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Example Embodiment

[0015] The beam compression process of the present invention is as figure 1 As shown, the specific process is as follows:

[0016] The TO tube socket 3 adopts the existing general structure, including a tube shell, a tube tongue and a tube pin, and the tube tongue is in the shape of a six-sided column. First evaporate the solder on the tube tongue as usual, then bond the semiconductor laser chip in the middle of the tube tongue so that the light-emitting cavity surface of the chip is flush with the upper end surface of the tube tongue, and then alloy at 180℃, and then bond Hehe Optoelectronics Testing.

[0017] Then use the cap 2 corresponding to the model of the TO socket 3 to package the cap 2 on the TO socket 3, and the cap 2 is in the middle of the socket 3, that is, the center line of the cap coincides with the center line of the socket.

[0018] Adhere the cylindrical lens 1 to the outside of the cap 2, such as figure 2 As shown, the cylindrical lens 1 is parallel to the cavi...

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Abstract

The invention provides a semiconductor laser TO tube seat packaging beam compression process which comprises the following steps: (1) evaporating solder on a tube tongue of a TO tube seat on the basis of conventional practice, bonding a tube core of the semiconductor laser in the middle part of the side of the tube tongue, leading the light-emitting cavity surface of the tube core and the upper end surface of the tube tongue to be parallel and level and then carrying out alloy, bonding and photoelectrical test; (2) packaging a tube cap which corresponds to the type of the TO tube seat on the TO tube seat, ensuring that the tube cap is in the middle part of the TO tube seat; (3) bonding a cylindrical lens outside the tube cap by utilizing an optical adjusting bracket, the cylindrical lens is parallel to the cavity surface of the tube core and is in the middle part of the cavity surface relative to the tube core. The invention realizes beam compression by bonding the cylindrical lens outside the tube cap and adjusting the position of the cylindrical lens, changes the realization method of the beam compression by bonding the cylindrical lens inside the tube cap and adjusting the position of the tube cap in the existing beam compression process, avoids carrying out grinding on the tube cap, and leads the shaping process to be improved by 15% to 20%.

Description

technical field [0001] The invention relates to a light beam compression structure of a semiconductor laser TO package, and belongs to the technical field of beam shaping of lasers. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, and have been widely used in industrial, medical and military fields, such as material processing, optical fiber communication, laser ranging, target indication, Laser guidance, laser radar, space optical communication, etc. With the continuous development of semiconductor lasers in various application fields, the requirements for the quality of laser beams also increase. [0003] Due to the special structure of the semiconductor laser, the divergence angle of the fast axis is relatively large, and the divergence angle of the slow axis is small, and the semiconductor laser beam is elliptical, which restricts the application of semiconducto...

Claims

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Application Information

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IPC IPC(8): H01S5/00H01S5/022H01S5/06
Inventor 汤庆敏苏建于果蕾夏伟徐现刚王海卫李佩旭刘长江
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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