Method for preparing fluorine doped tin oxide transparent conductive film
A fluorine-doped tin oxide, transparent conductive film technology, applied in ion implantation plating, metal material coating process, coating and other directions, can solve the problems of high temperature of film deposition substrate, inability to prepare thin film, etc., to achieve electrical conductivity And the effect of high optical transmittance, no pollution to the environment, and low cost
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Embodiment 1
[0019] (1) SnO with a purity of 99.99% 2 Powder and 99% SnF 2 The powder is fully mixed according to the weight ratio of 90:10, and pressed at a pressure of 200MPa and a temperature of 120°C for 25 minutes; sintered at a temperature of 200°C in air for 3000 minutes to produce SnO 2 : F target.
[0020] (2) The organic flexible substrate is a transparent polyester film with a thickness of 125 μm, which is cleaned by ultrasonic chemistry. Send the target material in step (1) and the cleaned organic flexible substrate into a radio frequency magnetron sputtering apparatus, and the distance from the target material to the substrate is 60 mm. Sputtering chamber basic vacuum 4.0×10 -4 Pa, sputtering gas argon pressure 1Pa, sputtering bias -70V, sputtering power 150W, substrate temperature at room temperature, film thickness 400nm. The film has a polycrystalline structure, and the resistivity of the film is 5×10 -4 Ωcm, the optical transmittance in the visible light range exceeds...
Embodiment 2
[0022] The target for sputtering is the same as in Example 1, except that in step (2), the organic flexible substrate adopts a transparent polycarbonate film with a thickness of 175 μm, the distance from the target to the substrate is 40 mm, and the basic vacuum of the sputtering chamber is 9× 10 -4 Pa, the argon pressure of the sputtering gas is 0.3Pa, the sputtering bias is 0V, the sputtering power is 50W, the substrate temperature is room temperature, and the film thickness is 400nm. The film has a polycrystalline structure, and the resistivity of the film is 7×10 -3 Ωcm, the optical transmittance in the visible light range exceeds 72%.
Embodiment 3
[0024] The target for sputtering is the same as in Example 1, except that in step (2), the organic flexible substrate adopts a transparent polyimide film with a thickness of 75 μm, the distance from the target to the substrate is 80 mm, and the basic vacuum of the sputtering chamber is 2 ×10 -4 Pa, the argon pressure of the sputtering gas is 5Pa, the sputtering bias is -100V, the sputtering power is 200W, the substrate temperature is room temperature, and the film thickness is 400nm. The film has a polycrystalline structure, and the resistivity of the film is 7×10 -4 Ωcm, the optical transmittance in the visible light range exceeds 88%.
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