Conductive silver paste with low halogen content
A conductive silver paste and content technology, which is applied in the direction of conductive materials, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of insufficient adhesion, high baking temperature, and high resistance of silver paste , to achieve the effect of moderate bendability and hardness, low baking temperature and low resistivity
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example 1
[0025] Example 1: Polyester resin 10%
[0026] Silver Powder 45%
[0027] Dispersant 3%
[0028] Adhesion Promoter 3%
[0029] Leveling agent 2%
[0030] Graphite powder 5%
[0031] Organic solvent 32%.
example 2
[0032] Example 2: Polyester resin 15%
[0033] Silver Dust 40%
[0034] Dispersant 8%
[0035] Adhesion Promoter 5%
[0036] Leveling agent 3%
[0037] Graphite powder 6%
[0038] Organic solvent 23%.
example 3
[0039] Example 3: Polyester resin 18%
[0040] Silver Powder 35%
[0041] Dispersant 5%
[0042] Adhesion Promoter 6%
[0043] Leveling agent 5%
[0044] Graphite powder 7%
[0045] Organic solvents 24%.
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