Substrate and magnetic device integrated DC-DC converter and preparation process thereof

A magnetic device, DC-DC technology, applied in the direction of converting DC power input to DC power output, instruments, electrical components, etc., can solve problems such as large volume, increase contact area, realize ultra-thin, and avoid device errors. Effect

Inactive Publication Date: 2010-02-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method still requires an independent magnetic core, and the ferrite core occupies a large volume, which makes miniaturization a bottleneck

Method used

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  • Substrate and magnetic device integrated DC-DC converter and preparation process thereof
  • Substrate and magnetic device integrated DC-DC converter and preparation process thereof
  • Substrate and magnetic device integrated DC-DC converter and preparation process thereof

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Experimental program
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Embodiment Construction

[0027] The present invention will be further described below in conjunction with accompanying drawing:

[0028] The invention has universality for the manufacture of substrates and magnetic device integrated DC-DC converters.

[0029] 1. Structural design: among the present invention, the coil is a zigzag coil, and the ferrite around the coil forms a closed inductance such as figure 1 As shown, the coil at both ends is extended to the side of the substrate, and the coil is connected to the electronic circuit on the substrate through side sealing.

[0030] 2. technology realizes: what the present invention adopted is LTCC (low temperature co-fired ceramics) technology, as figure 2 , the specific process is as follows. Add dispersants, plasticizers and binders to the low-temperature sintered ferrite powder, the models are: M1135, M1125 and B75702, ball milled evenly, cast into a 30um thick film by wet process, and then cut into A single diaphragm of specified size; a blind b...

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Abstract

The invention discloses a substrate and a magnetic device integrated DC-DC converter. A magnetic device is integrated in a circuit substrate of the converter, and a surface electronic circuit is arranged on the surface of the substrate, wherein the substrate is a ferrite substrate, and the magnetic device is a conductor coil in a shape like the Chinese character of 'hui' and forms a closed inductor with ferrites around the magnetic device; both ends of the conductor coil extend to the side of the substrate, and the conductor coil and the surface electronic circuit are connected through a sealing end at the side face. The conductor coil of the converter is embedded in the substrate, and the substrate is a carrier of the magnetic device and the surface electronic circuit, thereby realizing the passive integration of the magnetic device and the circuit substrate and ensuring that the substrate also has the functions of the magnetic device. A separated inductor or transformer is not neededto be arranged in an assembly process, thereby greatly reducing the overall volume of a power module.

Description

technical field [0001] The invention relates to the field of electronic power, in particular to a DC-DC converter integrated with a substrate and magnetic devices and a preparation process thereof. Background technique [0002] With the rapid development of electronic technology, the volume of various electronic systems is getting smaller and smaller, and the power supply system is constantly developing towards miniaturization and high power density. All the small power modules (such as the CPU in the computer) and portable devices of the whole machine are powered by the secondary power supply. How to reduce the volume of the secondary power supply has also become a subject to realize the miniaturization of the system. [0003] With the development of integrated circuits, one chip can realize many functions, which makes the control circuit of the power module highly integrated; but in the part with relatively large power, it must be handled by separate devices. Among variou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H02M3/00H05K1/16H05K1/18H05K3/30
Inventor 石玉郭海平孙兵尉旭波朱海周立文
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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