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Low-silver halogen free soldering paste

A technology of solder paste and halogen, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as not suitable for welding of fine-pitch components, not suitable for market demand, and easy collapse of solder paste, etc., to achieve Low cost, good welding performance, and less residue after welding

Inactive Publication Date: 2010-02-24
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high Ag content and high cost, it is not suitable for market demand, and the brazing performance is poor, and the solder paste is easy to collapse after printing, so it is not suitable for welding fine-pitch components.

Method used

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  • Low-silver halogen free soldering paste
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  • Low-silver halogen free soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The preparation method of the low-silver and halogen-free solder paste described in Example 1 is as follows: Weigh the components of the solder paste according to the weight parts of Example 1 in Table 1, and combine rosin and its derivatives, organic acid activator, and surfactant , Solvent and antioxidant materials are sequentially added to the container for heating, stirring and dissolving at a temperature not higher than 100°C, and then cooling to room temperature. Add thixotropic agent, disperse to 70℃ at high speed, and then cool to room temperature to obtain flux paste.

[0034] Then, 10.5% by weight of the soldering paste and 89.5% by weight of the alloy solder powder are evenly stirred to obtain the low-silver and halogen-free solder paste described in Example 1.

Embodiment 2

[0035] The preparation method of the low-silver and halogen-free solder paste described in Example 2 is as follows: Weigh the components of the flux paste according to the weight parts of Example 2 in Table 1, and the rest of the process is the same as in Example 1, and will not be repeated to obtain the flux paste .

[0036] Then, 11.5% by weight of the soldering paste and 88.5% by weight of the alloy solder powder are evenly stirred to obtain the low-silver and halogen-free solder paste described in Example 2.

Embodiment 3

[0037] The preparation method of the low-silver and halogen-free solder paste described in Example 3 is as follows: Weigh the components of the soldering paste according to the weight parts of Example 3 in Table 1, and the rest of the process is the same as that of Example 1, and will not be repeated to obtain the soldering paste. .

[0038] Then, 9.5% by weight of the soldering paste and 90.5% by weight of the alloy solder powder are evenly stirred to obtain the low-silver and halogen-free solder paste described in Example 3.

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PUM

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Abstract

The invention provides a low-silver halogen free soldering paste, which solves the problems that the existing soldering paste has high production cost and poorer soldering performance, and is not applicable to welding of components with precision spacing and the like. The low-silver halogen free soldering paste comprises the following components by weight percentage of 88 percent to 91 percent ofalloy welding powder and 9 percent to 12 percent of paste flux, wherein, the alloy welding powder comprises the following components by weight percentage of 0.1 percent to 0.9 percent of Ag, 0.1 percent to 0.8 percent of Cu and the balance Sn. The low-silver halogen free soldering paste has the advantages of low cost, good welding performance, no easy edge-collapse after printing and the like.

Description

Technical field [0001] The invention relates to a solder paste, in particular to a low-silver halogen-free solder paste. It belongs to the field of surface assembly technology in the microelectronics industry. Background technique [0002] In recent years, computers, communication equipment, instruments and household appliances have developed towards miniaturization, high performance, and multi-purpose. Electronic components must also be miniaturized. The development of surface mount technology (SMT) is precisely due to the appearance of micro electronic components and high-precision fine electronic integrated chips. Surface mount technology (SMT) soldering methods and required soldering materials have also changed, and the raw material solder paste used in the surface mount technology (SMT) industry has become more and more widely used, and is increasingly being valued by electronics manufacturers. [0003] Traditional solder paste products consist of tin-lead solder powder and...

Claims

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Application Information

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IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 邓勇余洪桂刘婷池思思程峰
Owner 上海一远电子科技有限公司
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